Emc Corporation

Daniel A Field

John Kevin Bowman

Steven R Cieluch

David Boudreau

Dale T Morgan

A power measurement transducer includes a first surface configured to thermally couple the power measurement transducer to a device under test. A second surface is essentially parallel to and spaced apart from the first surface. Two or more temperature measurement elements are positioned between the first and second surfaces. The power measurement transducer is configured to allow at least a portion of the power generated within the device under test to enter the power measurement transducer through the first surface and exit the power measurement transducer through the second surface.

Power measurement transducer

A method of determining thermal output of a device under test includes attaching a power measurement transducer to a device under test, wherein the power measurement transducer includes two or more temperature measurement elements. A test sequence is applied to the device under test. One or more signals produced by the power measurement transducer are monitored to determine a quantity of power produced by the device under test during the test sequence.

A power measurement transducer includes a thermally conductive heat spreading device having a first surface configured to thermally couple the power measurement transducer to a device under test. Two or more temperature measurement elements are positioned within the thermally conductive heat spreading device.

The present invention is directed to techniques for obtaining an electrical characteristic of a circuit board assembly process which involves mounting a module to an installation location of a circuit board using the circuit board assembly process, and measuring leakage current of the test structure in response to an electrical signal (e.g., a voltage) applied to the installation location. One can then determine the surface insulation resistance (SIR) of the test structure based on the electrical signal and the leakage current in order to assess the suitability of the circuit board assembly process. One arrangement of the invention is directed to a system for obtaining an electrical characteristic of a circuit board assembly process. The system includes a test structure having (i) a circuit board having a module installation location and an interface location in electrical communication with the module installation location, and (ii) a module which is mounted to the circuit board at the module installation location using the circuit board assembly process. The system further includes a signal generator that couples to the interface location of the circuit board, and that applies an electrical signal to the module installation location of the circuit board through the interface location. Additionally, the system includes a detector that that couples to the interface location, and that measures leakage current of the test structure in response to the electrical signal. The leakage current is itself an obtained electrical characteristic of the circuit board assembly process. However, the leakage current and the electrical signal enable determination of surface insulation resistance of the test structure, as another electrical characteristic of the circuit board assembly process.

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Northborough, MA, United States of America

Daniel A Field