Enthone Incorporated

Other

Macdermid Enthone Gmbh

Danica Elbick

Andreas Königshofen

Markus Dahlhaus

Christoph Werner

Andreas Möbius

Andreas Konigshofen

Ulrich Prinz

Peter Pies

Wolfgang Clauberg

The present invention relates to a method for direct metallization of non-conductive substrates as well as a conductor solution used in such a method. According to the invention, it is proposed to contact a non-conductive substrate surface after activation by a noble metal colloid-containing activator solution with a conductor solution, which comprises a metal that is reducible by a metal of the activator solution, a complexing agent and a reducing agent.

Method for direct metallization of non-conductive substrates

A process for treating the surface of a metal substrate comprising a constituent metal selected from the group consisting of Cr, Cu, Mn, Mo, Ag, Au, Pt, Pd, Rh, Pb, Sn, Ni, Zn, in some cases Fe, and alloys of these metals. An anodic potential is applied to the metal surface in an electrolytic circuit comprising the metal surface, a cathode, and an electrolytic solution that is in contact with the metal surface and in electrically conductive communication with the cathode. The electrolytic solution may contain an electrolyte comprising anions of phosphate, phosphonate, phosphite, phosphinate, nitrate, borate, silicate, molybdate, tungstate, carboxylate, oxalate and combinations thereof. The anion may comprise a polymer having a pendent moiety selected from the group consisting of phosphate, phosphonate, phosphite, phosphinate, sulfate, sulfonate, carboxylate and combinations thereof. The potential applied to the circuit is such that the substrate is anodically oxidized and reacts with the anion to form a composition that imparts an enhanced property to the metal surface. Preferably, the pH of the electrolytic solution is less than about 6.0, the potential applied is between about 0.5 and about 20 volts, and the current density is between about 0.01 and 2 amps/dmof the geometric surface area of metal in contact with the electrolytic solution and is controlled such that nascent cations of said constituent metal produced by anodic oxidation of said constituent metal react with said anions at the metal surface without significant formation of any oxide or hydroxide of said constituent metal.

Method for the post-treatment of metal layers

An electrolytic composition for the deposition of a matt metal layer onto a substrate and deposition process where the composition comprises

Electrolyte and process for depositing a matt metal layer

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Solingen, Germany

Danica Elbick