Zimmer Technology, Inc.

Zimmer Gmbh

Dana Medlin

Steven Charlebois

H Ravindranath Shetty

Michael E Hawkins

Steven A Zawadzki

Leslie N Gilbertson

Dirk Pletcher

William L Clarke

Dale Frederick Swarts

Joel G Scrafton

Steven J Charlebois

Dirk L Pletcher

William B Clarke

Steven James Charlebois

William Clarke

Ravindranath Ii Shetty

A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components, femoral hip components, and/or acetabular cups. The method, in one embodiment thereof, comprises providing a solid metal substrate; providing a porous metal structure; contouring a surface of the porous metal structure; placing the porous structure against the substrate such that the contoured surface of the porous metal structure is disposed against the substrate, thereby forming an assembly; applying heat and pressure to the assembly in conjunction with thermal expansion of the substrate in order to metallurgically bond the porous structure and the substrate; and removing mass from the substrate after the porous structure is bonded to the substrate, thereby finish processing the assembly.

Method for attaching a porous metal layer to a metal substrate

Method for attaching porous metal layer to a metal substrate

A method for attaching a porous metal layer to a dense metal substrate, wherein the method is particularly useful in forming orthopedic implants such as femoral knee components or acetabular cups. The method, in one embodiment thereof, comprises providing a structured porous layer; providing a dense metal substrate; providing a binding mixture; applying the binding mixture to the exterior of the substrate; placing the porous layer against the substrate such that the binding mixture is disposed there between forming an assembly; and heat treating the assembly to metallurgically bond the porous layer to the substrate.

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Warsaw, IN, United States of America

Dana Medlin