Kulicke and Soffa Industries, Inc.

Sela Semiconductor Engineering Laboratories Ltd.

Dan Vilenski

Albert Soffa

Glenn B Bilane

Lawrence M Rubin

Isaac Mazor

Frederick W Kulicke, Jr

Moshe E Sade

Richard J Elles

Kalman Kaufman

Elik Chen

William Wing

Asher Brockmann

Razon Ely

Colin Smith

Ely Razon

Method and apparatus for cleaving semiconductor wafers

A method for high speed bonding of fine wires to electrodes includes a method of teaching the wire bonding tool the exact point of engagement of the bonding tool with the semiconductor. The bonding position point of engagement is employed to calculate a tolerance inflection point representative of the point in space where the bonding tool must start a constant velocity approach to the first bonding position. In similar manner, the point of engagement of the bonding tool with the semiconductor is determined and from that position a reset point is calculated representative of point in space where the bonding tool will start its rapid decelleration approach to the tolerance inflection point. The bonding tool may then be acceleration toward the bonding position with optimum speed without crashing into the semiconductor.

Wire bonding apparatus

The present invention teaches a novel method of making ultrasonic fine wire interconnections between pads on a semiconductor chip and lead out terminals which may be performed with commercially available computer controlled automatic wire bonding machines having an ultrasonic bonding tool holder. A capillary wedge bonding tool is employed which has an annular working face similar in cross-section to a conventional narrow face bonding wedge. When the second bond of an interconnecting wire is made, the capillary wedge bonding tool is moved away from the second bond to leave a small portion of the wire exposed out of the capillary wedge bonding tool. The wire is clamped and the bonding tool is then moved in a predetermined direction away from the second bond to break the wire and form a wire bonding tail. The predetermined direction of movement is at an angle which properly aligns the wire bonding tail in an angular direction under the annular working face of the capillary wedge bonding tool without the necessity of rotating the wedge bonding tool relative to the semiconductor chip.

Method of making fine wire interconnections

In a high speed automatic fine wire bonding machine of the type adapted to produce a wire interconnection between two bonding points on a semiconductor device there is provided a method of making consistent, exact predetermined lengths of wire under the working face of a bonding tool after a second bond is finished and in preparation for making the next first bond of a wire interconnection.

Method of making constant bonding wire tail lengths

A method for high speed bonding of fine wires to electrodes is provided employing a processor controlled wire bonder wherein the bonding tool of the wire bonder is positioned over an electrode on a simiconductor and is accelerated toward the electrode. Shortly before the bonding tool reaches the electrode, the bonding tool is moved toward the electrode at a substantially linear predetermined velocity so that the bonding tool imparts a controlled kinetic energy to the wire as a first bonding force, a second predetermined preload bonding force is applied to the bonding tool at the time of engagement and subsequently a third and final predetermined bonding force is applied to the bonding tool to bond the fine wire to the electrode at high speeds.

High speed wire bonding method

An apparatus for bonding wires on semiconductors is provided with a processor controlled vertical drive mechanism coupled to a novel bonding head of the type having a bonding tool mounted therein. The height of the bonding tool at the reset position and at the bonding position may be programmed into the processor for different semiconductor devices or workpieces. Indicating means are provided on the novel bonding head for establishing the reset position and the bonding positions so that the bonding tool is taught a series of predetermined vertical positions during a bonding cycle. The apparatus is also programmed to compute intermediate positions between said predetermined vertical positions to obtain optimum high speed movement of the bonding head and the bonding tool during subsequent bonding cycles.

A bonding head of the type having a bonding tool mounted in the bonding tool holder is provided with a pivotable wire clamp which is movable toward and away from the rear of the bonding tool. The wire clamp is pivotally movable to three distinct positions by a single solenoid. The wire clamp is opened and closed by a second solenoid. The solenoids are mounted on the pivot axis of the bonding tool holder in a manner which substantially prevents the shock force of actuation of the solenoid from being imparted into the bonding tool holder or the bonding tool during a bonding operation.

Solenoid actuated wire feed and tearing apparatus

An apparatus for automatically positioning a wire bonding machine at a second bond position is provided with a plurality of individually adjustable second bond positioning devices set at second bond positions and cooperable with second bond positioning actuating means. After positioning a semiconductor at a first bond position and completing a first bond, the second bond actuating means cooperating with a second bond positioning device automatically moves the semiconductor to a second bond position. After completing the second bond, the second bond positioning actuating means is released permitting the semiconductor to return to a first bond position as another second bond positioning device is cycled into active position.

Growing community of inventors

Hatboro, PA, United States of America

Dan Vilenski