Intel Corporation

Dan R McCutchan

Michael P Brownell

Leonard O Turner

Glen Patrick Gordon

Larry B Wheeler

Hong Xie

David J Ayers

Gregory Turturro

Bill Samaras

Kevin J Haley

William A Samaras

The invention in one particular embodiment is a bracket including a base having an opening shaped to accommodate a socket for an integrated circuit device; and at least one containment member rigidly extending from the base to define a void shaped to accommodate the integrated circuit. In another embodiment, a method for mounting an integrated circuit device to a printed circuit board comprises affixing a bracket to the printed circuit board; mounting a socket to the printed circuit board; and coupling the integrated circuit to the socket, the integrated circuit being vertically and laterally constrained by the bracket.

Mounting bracket for integrated circuit device

A tool which accurately controls the thickness of a thermal grease applied to an integrated circuit that is mounted to a printed circuit board. The tool includes a bracket that supports the printed circuit board and the integrated circuit. A thermal grease is applied to the top surface of the integrated circuit. A lid is attached to the bracket to capture the printed circuit board. The lid has a platen that is separated from the integrated circuit by a space which has a predetermined thickness. The space defines the thickness of the thermal grease. Any excess thermal grease is pushed out of the space by the lid so that a consistent thickness of thermal grease is applied for each integrated circuit assembly. The bracket, lid, integrated circuit and printed circuit board can be mounted to a motherboard as a single integrated circuit module. Alternatively, the lid can be detached from the base so that the grease covered integrated circuit can be removed from the tool for subsequently assembly.

Controlled bondline thickness attachment mechanism

An integrated circuit cartridge has been described. The cartridge includes a heat pipe lid that comes in thermal contact with at least one integrated circuit die. The integrated circuit die is mounted on a substrate that is held in a cavity of a pin chassis that has a grid array of pins for interconnection with a socket. The integrated circuit die can be mounted on a secondary substrate that is mounted to a primary substrate. The substrate has an edge connector to supply power to the integrated circuit die, freeing the grid array of pins to be used for signal interconnects. The substrate has a grid of connections soldered to the grid array of pins on the pin chassis. The pin chassis also supplies key structures that aid in alignment of the pins and a socket.

Integrated circuit cartridge

The invention in one embodiment is a zero insertion force socket including a base; a cover engaged with the base to reciprocate in first and second directions; and a lever pivotably mounted to the base to move the cover in the first direction when the lever is pivoted laterally from a first position to a second position. In another embodiment, the invention is a printed circuit board assembly including a printed circuit board; a zero insertion force socket surface mounted to the printed circuit board; and a processor coupled to the zero insertion force socket.

Zero insertion force socket and method for employing same to mount a

Printed circuit board mounting assembly and a method for mounting an

An improved connector scheme for a power pod power delivery system provides a low-resistance, low inductance path between a power source and a power consuming module. Specifically, the present invention is a connector scheme comprising a printed circuit board having a plurality of sets of planar pads, each of the plurality of sets of planar pads being coupled to a power source and/or a signal source, and a flexible connection for detachably coupling with each of the plurality of sets of planar pads on the printed circuit board.

Connector scheme for a power pod power delivery system

A printed circuit board assembly that has a heatpipe. The assembly includes an integrated circuit package that is mounted to a printed circuit board. The heatpipe is attached to a plastic mold that is mounted to the printed circuit board. When assembled to the circuit board, the heatpipe is thermally coupled to the integrated circuit package. The plastic mold is lightweight and relatively inexpensive to produce. The mold also provides enough structural rigidity to prevent warping of the heatpipe.

Injection molded thermal interface system

A power delivery system includes a circuit board, a power consuming module and a dc--dc converter. The printed circuit board has on it a first signal connector, a pair of first contacts to which a first voltage is supplied, spaced from said connector, and fasteners spaced from said pair of first contacts. The power consuming module has a second signal connector, mating with the first signal connector, and has respective upper and lower power pads for receiving low voltage power. The dc--dc converter converts the first voltage to a lower voltage. The dc--dc converter has a pair of second contacts contacting said pair of first contacts, surfaces mating with said fasteners and holding the converter on the printed circuit board such that said second contacts are in firm contact with said first contacts, and a laterally extending connector having upper and lower contacts supplying the lower voltage and engaging the upper and lower power pads of the power consuming module.

Growing community of inventors

Redwood City, CA, United States of America

Dan R McCutchan