Advanced Cooling Technologies, Inc.

Thermavant Technologies, LLC

Dan Pounds

Chien-Hua Chen

Richard W Bonner, Iii

Bradley Richard

Greg Hoeschele

Taylor Maxwell

Devin Pellicone

Dan Reist

William G Anderson

Benjamin Alexander

William Anderson

A loop heat pipe evaporator includes a porous primary wick, and a nonporous envelope unseparatingly surrounding the primary wick. The primary wick and the envelope are of one-piece construction.

Loop heat pipe evaporator

A heat rejection panel comprising a first and a second plate. The first plate comprises an oscillating heat pipe face having a plurality of first opened elongated recesses formed therein, and the second plate comprises an oscillating heat pipe face having a plurality of second open elongated recesses formed therein. The first plate oscillating heat pipe face is hermetically sealed to the second plate oscillating heat pipe face forming a bond joint therebetween. The first plate caps the second open elongated recesses and the second plate caps the first open elongated recesses such that first open elongated recesses are physically and fluidly connected to the second open elongated recesses, thereby forming at least one non-planar oscillating heat pipe channel within the panel that reciprocates back and forth across the bond joint having the bond joint as a longitudinal axis.

Heat transfer panel having non-planar internal channels with single planar joint

Growing community of inventors

Columbia, MO, United States of America

Dan Pounds