Hisense Broadband Multimedia Technologies Co., Ltd.

Haier Group Corporation And Qing Dao Haier Electronic Co., Ltd.

Haier Group Corporation

Haier Group Technology R&d Center

Dan Li

Qinhao Fu

Yifan Xie

Tengfei Wang

Mengbo Fu

Kai Liu

Benzheng Dong

Yongzheng Tang

Guangchao Du

Ming Li

Honghao Zhang

Hui Sun

Bing Bai

Ying Chen

Yunpeng Jiang

Chuanbin Li

Zhanpeng Zhang

Yilong Xu

Bao Liu

Feng Cui

Bingbing Lou

Chao Qin

Xiulian Dong

Xuetao Huang

Yangtao Dang

Depeng Diao

The present disclosure discloses an optical module including a circuit board; a housing assembly including a light-receiving portion and a light-emitting cavity separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch through which one end of the circuit board is inserted into the housing assembly; a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; a concave region is formed in the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged therein to lift the laser assembly to reduce height difference between wire bonding surface of the laser assembly and lower surface of the circuit board.

Optical module

An optical module includes a base, a first cover, a circuit board, a light emitting assembly and a light receiving assembly. The light emitting assembly includes a plurality of light-emitting chips and an optical multiplexer. The plurality of light-emitting chips are disposed on the first bottom plate. The optical multiplexer is disposed on the first cover and is located in a laser exit direction of the plurality of light-emitting chips. The light receiving assembly includes an optical demultiplexer and a plurality of light-receiving chips. The optical demultiplexer is disposed on the first cover. The plurality of light-receiving chips are disposed on the circuit board and are located in a laser exit direction of the optical demultiplexer.

An optical module includes a shell, a circuit board, a light-receiving device and an optical fiber ribbon. The circuit board is located in the shell. The light-receiving device is disposed on the circuit board and is electrically connected to the circuit board. An end of the optical fiber ribbon is connected to the light-receiving device. The light-receiving device includes a light-receiving chip and a focusing lens. The light-receiving chip is disposed on a surface of the circuit board and has a photosensitive surface. The focusing lens is disposed opposite to the photosensitive surface of the light-receiving chip, and is configured to converge light transmitted by the optical fiber ribbon to the photosensitive surface of the light-receiving chip.

The present disclosure discloses an optical module including: a circuit board; a housing assembly divided by a separation board into a first portion and a second portion that are stacked one above the other, wherein a light-emitting cavity is formed in the second portion, and a partition wall is provided in the first portion to separate the first portion into a light-receiving cavity and a slot, and is provided with a plurality of light-passing holes via which the light-receiving cavity is in communication with the slot; an optical fiber adapter disposed in the housing assembly and in communication with the light-receiving cavity; a light-emitting assembly arranged in the light emitting cavity and electrically connected to the circuit board, wherein heat generated by the light-emitting assembly is conducted to a surface of the housing assembly via the partition wall; and a light-receiving assembly.

An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.

An optical module includes: a casing; a printed circuit board (PCB) connected to a first side wall of the casing and configured to provide first electrical signals to an optical transmitter assembly; the optical transmitter assembly arranged in the casing and configured to convert the first electrical signals into first optical signals; an optical receiver adapter and an optical transmitter adapter arranged outside the casing and connected to a second side wall of the casing, wherein the optical transmitter adapter is configured to receive second optical signals; a first displacement prism arranged in the casing and configured to direct the second optical signals toward an optical receiver assembly; and the optical receiver assembly configured to convert the second optical signals into second electrical signals. At least one component of the optical receiver assembly is arranged in the casing.

An optical module includes a housing, at least one optical assembly and at least one sealing member. The housing includes a housing body, a cover and at least one vent hole therein. At least part of each optical assembly is located in the housing body. Each sealing member is located at a respective one of the at least one vent hole. The sealing member has a central axis and includes a first cylinder, a truncated cone, and a second cylinder, a diameter of the first cylinder is greater than a diameter of the second cylinder. Each vent hole is a stepped hole including a portion with a first aperture and a portion with a second aperture, the first aperture is greater than the second aperture. The first cylinder fits the portion with the first aperture, and the second cylinder fits the portion with the second aperture.

It is disclosed a wireless power supplying system and an self adaptive adjustment method thereof. The method includes: a step for detecting an operating status of an electric power sending unit and determining, based on the detected operating status, whether the electric power transmitting unit satisfies a condition of a normal operation of the system and a step for determining, based on the above determination result, whether to adjust a master frequency of an oscillating circuit so that the master frequency of the oscillating circuit is between a resonance frequency of a transmitting coil and a resonance frequency of a receiving coil. The master frequency of the oscillating circuit is adjusted automatically, so that the master frequency is always close to the resonance frequency of the transmitting coil and that of the receiving coil, thereby maintaining stably the power output of the system.

Wireless power supplying system and adaptive adjustment method thereof

Growing community of inventors

Shandong, China

Dan Li