Asia Vital Components (china) Co., Ltd.

Asia Vital Components (shen Zhen) Co., Ltd.

Dan-Jun Chen

Guo-Hui Li

Pai-Ling Kao

Fu-Ming Zhong

Jun Wang

A heat dissipation structure includes a base provided on top and bottom surfaces with a solder dispensing opening and a plurality of receiving grooves, respectively; and a plurality of heat pipes. The solder dispensing opening is transversely extended across and communicable with a top of the receiving grooves. The heat pipes are fitted in the receiving grooves and subjected to a mechanical processing to be flush with the bottom surface of the base. A type of solder is filled into a space between the heat pipes and the receiving grooves via the solder dispensing opening. Then, the heat pipes and the base are heated in a heating furnace. After removing the heat pipes and the base from the furnace, the solder is cooled and cured to form a solder layer, which fills up the space and tightly connect the heat pipes to the base to avoid thermal resistance between them.

Heat dissipation structure

A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. The independent flow channels communicate with each other. And, the independent flow channels respectively have an amount of working fluid filled therein.

Heat dissipation unit and heat dissipation device using same

A roll bond plate evaporator structure is disclosed. The roll bond plate evaporator structure includes a heat dissipation member, at least one inlet and at least one outlet. The heat dissipation member is composed of a first plate body and a second plate body, which are correspondingly mated with each other. The first and second plate bodies together define a flow way. A working fluid is filled in the flow way. The inlet is formed at one end of the heat dissipation member in communication with the flow way and the outlet is formed at the other end of the heat dissipation member in communication with the flow way.

Roll bond plate evaporator structure

A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

Growing community of inventors

Shenzhen, China

Dan-Jun Chen