Rf Micro Devices, Inc.

Qorvo Us, Inc.

Dan Carey

Jeffrey Scott Walker

Gary D Messner

Thong Dang

Ma Shirley Asoy

Milind Shah

Thomas Scott Morris

Ulrik Riis Madsen

John Robert Siomkos

Brian D Sawyer

Brian Howard Calhoun

Michael T Fresina

Mark Alan Crandall

John Cody Bailey

Naiqian Zhang

J Phillip Conlon

The present disclosure relates to an integrated circuit module with electromagnetic shielding. The integrated circuit module includes a die with an input/output (I/O) port at a bottom surface of the die, a mold compound partially encapsulating the die and leaving the bottom surface of the die exposed, a first dielectric pattern over the bottom surface of the die, a redistribution structure over the first dielectric pattern, and a shielding structure. The I/O port at the bottom surface of the die is exposed through the first dielectric pattern. The redistribution structure includes a shield connected element that is coupled to the I/O port and extends laterally beyond the die. The shielding structure resides over a top surface of the mold compound, extends along side surfaces of the mold compound, and is in contact with the shield connected element. Herein, the shielding structure does not extend vertically beyond the shield connected element.

Wafer level fan-out with electromagnetic shielding

Shielded electronic packages may have metallic lead frames to connect an electromagnetic shield to ground. In one embodiment, a metallic lead frame of the electronic package and a surface of the metallic lead frame defines a component area for attaching an electronic component. The metallic lead frame includes a metallic structure associated with the component area that may have a grounding element for connecting to ground and one or more signal connection elements, such as signal leads, for transmitting input and output signals. The electromagnetic shield connects to the metallic lead frame to safely connect to ground while maintaining the signal connection elements isolated from the shield.

Methods of forming a microshield on standard QFN package

The present disclosure integrates electromagnetic shielding into a wafer level fan-out packaging process. First, a mold wafer having multiple modules is provided. Each module includes a die with an I/O port and is surrounded by an inter-module area. A redistribution structure that includes a shield connected element coupled to the I/O port of each module is formed over a bottom surface of the mold wafer. The shield connected element extends laterally from the I/O port into the inter-module area for each module. Next, the mold wafer is sub-diced at each inter-module area to create a cavity. A portion of the shield connected element is then exposed through the bottom of each cavity. A shielding structure is formed over a top surface of the mold wafer and exposed faces of each cavity. The shielding structure is in contact with the shield connected element.

Embodiments include devices and methods for manufacturing a module having a first shielded compartment and a second shielded compartment, wherein the first shielded compartment is electrically isolated from the second shielded compartment. Electrical conductivity is controlled in a manner in which current flow between shielded circuits is directed to reduce or eliminate energy from being coupled between one or more shielded compartments on the same module. Each module may have a plurality of individual shielded compartments, where each compartment has a dedicated ground plane. The shields for each compartment may be tied to the dedicated ground plane of the compartment. Because the dedicated ground planes are not tied together, each of the shielded compartments on the modules remains isolated from all the other shielded compartments on the modules. In some embodiments having a plurality of shielded compartments, there is at least one isolated shielded compartment depending upon the design needs of the module.

Compartmentalized shielding of selected components

In one embodiment, a meta-module having circuitry for two or more modules is formed on a substrate, which is preferably a laminated substrate. The circuitry for the different modules is initially formed on the single meta-module. Each module will have one or more component areas in which the circuitry is formed. A metallic structure is formed on or in the substrate for each component area to be shielded. A single body, such as an overmold body, is then formed over all of the modules on the meta-module. At least a portion of the metallic structure for each component area to be shielded is then exposed through the body by a cutting, drilling, or like operation. Next, an electromagnetic shield material is applied to the exterior surface of the body of each of the component areas to be shielded and in contact with the exposed portion of the metallic structures.

Process for manufacturing a module

Method for forming an electronic module having backside seal

Method of manufacturing a module

The present invention provides a substantially hermetically sealed enclosure about an active device area of a semiconductor substrate. The enclosure is created by forming a guard ring around the active device area on the substrate, and forming a metal panel over and in contact with the guard ring to enclose the active device area. The guard ring is a laminate of metal rings formed from alternating metal filled via rings and metal trace rings. The guard ring is formed on an ohmic contact ring on the surface of the substrate. An annealing process may be used to hermetically seal the guard ring to the ohmic contact ring.

Moisture protection metal enclosure

Growing community of inventors

Kernersville, NC, United States of America

Dan Carey