International Business Machines Corporation

Globalfoundries Inc.

Elpis Technologies Inc.

Damyon L Corbin

Charles F Musante

John C Hall

Anthony K Stamper

Jeffrey P Gambino

Timothy Charles Krywanczyk

Jay Sanford Burnham

George A Dunbar, Iii

Kenneth F McAvey, Jr

Patrick A Raymond

A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

Package assembly for thin wafer shipping and method of use

The present disclosure relates to semiconductor structures and, more particularly, to a method to control depth of etch in deep via etching and related structures. The method includes: forming an interface within the substrate between an etch control dopant and material of the substrate; etching a via within substrate; and terminating the etching of the via at the interface upon detection of the interface.

Controlling of etch depth in deep via etching processes and resultant structures

A backside metal ground plane with improved metal adhesion and methods of manufacture are disclosed herein. The method includes forming at least one through silicon via (TSV) in a substrate. The method further includes forming an oxide layer on a backside of the substrate. The method further includes forming a metalized ground plane on the oxide layer and in electrical contact with an exposed portion of the at least one TSV.

Backside metal ground plane with improved metal adhesion and design structures

Growing community of inventors

Jericho, VT, United States of America

Damyon L Corbin