Solexant Corporation

Nuelight Corporation

Other

Damoder Reddy

Craig Leidholm

Puthur D Paulson

Charlie Hotz

W Edward Naugler, Jr

Disclosed is a novel thin film photovoltaic device and a process of making. The device comprises an interface layer between the absorber layer and the electrode resulting in an improved back contact and improved device efficiency. The interface layer comprises a material comprising a M-(Group VIA)compound, where M is a transition metal the Group VIA designates Te, Se and/or S.

Back contact for thin film solar cells

The present invention discloses thin film photovoltaic devices comprising Group II-VI semiconductor layers with a substrate configuration having an interface layer between the absorber layer and the window layer to create improved junctions. The present invention also discloses methods for making and surface treatments for thin film photovoltaic devices comprising Group II-VI semiconductor layers with a substrate configuration to create devices with improved junctions.

Junctions in substrate solar cells

The present invention discloses thin film photovoltaic devices comprising Group II-VI semiconductor layers with a substrate configuration having an interface layer between the back electrode and the absorber layer capable of creating an ohmic contact in the device. The present invention discloses thin film photovoltaic devices comprising Group II-VI semiconductor layers with a superstrate configuration having an interface layer between the back electrode and the absorber layer capable of creating an ohmic contact in the device where the interface layer comprises nanoparticles or nanoparticles that are sintered.

An electroluminescent device contains (1) first and second electrodes, at least one of which is transparent to radiation; (2) a hole conducting layer containing first nanoparticles wherein the hole conducting layer is in contact with said first electrode; (3) an electron conducting layer containing second nanoparticles where the electron conducting layer is in contact with the hole conducting layer and the second electrode; and optionally (4) a voltage source capable of providing positive and negative voltage, where the positive pole of the voltage source is connected to the first electrode and the negative pole is connected to the second electrode. In some embodiments, the electroluminescent device also includes an electron-hole combination layer between the hole and electron conducting layers.

Nanostructured electroluminescent device and display

System, device, and method for receiving or sensing touch or light input to an emissive display such as to a OLED display using the same or different sensors as are used to sense and maintain a pixel luminance. Penlight and touch screen data input system and method for display. A sidelight illuminated display and touch panel input device. Method and device for reading display pixel emission and ambient luminance levels. Emissive display having sensing for luminance stabilization and user light or touch screen input. Method and device for emissive display using shielded or partially shielded sensors. Emissive pixel display device characterized in that photon sensors are disposed within pixels and operated to sense photons emitted by emitter within pixel and ambient photons emitted by sources outside pixel, sensed internally emitted photons being for luminance feedback control and sensed ambient photons being used to detect external light source or sources.

Penlight and touch screen data input system and method for flat panel displays

The present invention uses an open loop feedback technique to control emissive pixels of a printhead of a printer. The open loop feedback technique involves integrating the light intensity of the emissive pixel over a predetermined period of time, averaging the integrated value, comparing the averaged value to a threshold value, and adjusting the input voltage to the OLED of the pixel based on the comparison.

Feedback control apparatus and method for an emissive printhead

Process and device structures for constructing RFID tag and smart card and toy controller integrated circuit transceivers built inexpensively using flat panel display manufacturing machines on large plastic or glass or plastic laminated to glass substrates using thin film technologies at low temperatures and using chemicals and gases which will not attack or damage the substrate. Also disclosed are structures to eliminate the reliability problems caused by differential strain caused by different coefficients of thermal expansion.

Growing community of inventors

Los Gatos, CA, United States of America

Damoder Reddy