Infinera Corporation

Damien Lambert

Fred A Kish, Jr

David F Welch

Charles H Joyner

Mark Missey

Richard P Schneider

Atul Mathur

Frank Peters

Andrew G Dentai

Radhakrishnan L Nagarajan

Masaki Kato

Han Henry Sun

Kuang-Tsan Wu

John Duncan McNicol

Mehrdad Ziari

Vikrant Lal

David J Krause

An optical modulator includes a splitter, phase modulators, amplitude modulators, intensity modulators, and a combiner. The splitter is configured to receive light, and split the light into portions of the light. Each of the phase modulators is configured to receive a corresponding one of the portions of the light, and modulate a phase of the portion of the light to provide a phase-modulated signal. Each of the amplitude modulators is configured to receive a corresponding one of the phase-modulated signals, and modulate an amplitude of the phase-modulated signal to provide an amplitude-modulated signal. Each of the intensity modulators is configured to receive a corresponding one of the amplitude-modulated signals, and modulate an intensity of the amplitude-modulated signals to provide an intensity-modulated signal. The combiner is configured to receive the intensity-modulated signals, combine the intensity-modulated signals into a combined signal, and output the combined signal.

Intensity-based modulator

A monolithic photonic integrated circuit (PIC) chip where the active waveguide cores of the modulated sources of the PIC are multiple quantum wells (MQWs) and the passive waveguide cores of an optical combiner are a bulk layer or material. The cores of the waveguide cores may be a quaternary such as InGaAsP or InAlGaAs.

Method of manufacturing and apparatus for a transmitter photonic integrated circuit (TXPIC) chip

A monolithic photonic integrated circuit (PIC) chip comprises an array of modulated sources providing a plurality of channel signals of different wavelengths and an optical combiner coupled to receive the channel signals and produce a combined output of the channel signals. The arrays of modulated sources are formed as ridge waveguides to enhance the output power from the respective modulated sources so that the average output power from the sources is approximately 2 to 4 times higher than in the case of comparable arrays of modulated sources formed as buried waveguides.

Transmitter photonic integrated circuit (TxPIC) chip with enhanced power and yield without on-chip amplification

Growing community of inventors

Sunnyvale, CA, United States of America

Damien Lambert