Stmicroelectronics (crolles 2) Sas

Damien Jeanjean

Thierry Berger

The present disclosure relates to a method for manufacturing a pixel that includes depositing an insulating layer on an exposed face of an interconnect structure of an integrated circuit, the interconnect structure having a conductive element flush with said exposed face; etching an opening passing through the insulating layer to the conductive element; depositing an electrode layer on and in contact with the conductive element and the insulating layer; performing chemical mechanical planarization up to the insulating layer, a portion of the electrode layer left in place in the opening forming an electrode; and depositing a film configured to convert photons into electron-hole pairs when a ray at an operating wavelength of the pixel reaches the pixel.

Growing community of inventors

Grenoble, France

Damien Jeanjean