Ismeca Semiconductor Holding Sa

Damien Coste

Serge Künzli

Marco Oberli

Guy Ramel

Patrice Schwindenhammer

Yuri Lopez De Meneses

Pierrick Abrial

Massimo Fauro

Philippe Viverge

David Chavaillaz

Yuri De Meneses

According the present invention there is provided a method for adjusting a component handling assembly, the component handling assembly comprising, a plurality of stations at least some of which have a nest which can receive a component, and a rotatable turret having a plurality of component handling heads, and wherein the turret can rotate to transport components between the plurality of stations, the method comprising the steps of, capturing a first image of a reference element located at a first station, using a camera which is located on the rotatable turret; identifying the position in the first image of the center of the reference element; rotating the turret so that the camera on the turret is in a position where it can capture a second image of nest of a second station; capturing a second image of the nest of the second station, using said camera; identifying the position in the second image of the center of the nest of the second station; superimposing a marker on the second image at the same position as the position of the center of the reference element in the first image; adjusting the second station until the position in the second image of the center of the nest of the second station is aligned with the marker. There is further provided a corresponding component handling assembly.

Component handling assembly and method of adjusting a component handling assembly

A wafer handler including, a wafer loading station () for loading a wafer () mounted on a tack film (); a tensioner () for tensioning the tacky film; a picking module () for successively picking a plurality of devices from the wafer; a vision system () with one or several cameras () for capturing a first image of the wafer or of portions of the wafer, the first image showing a plurality of devices, wherein the vision system is arranged for determining from the first image the individual position of a plurality of devices. The wafer handler further includes an additional camera () positioned proximate to the picking module () and arranged for capturing an second image of a device to be picked, wherein the second image is used for fine adjustment of the wafer so that the device to be picked is centered under the picking module.

Wafer handler comprising a vision system

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Le Locle, Switzerland

Damien Coste