Pacific Star Communications, Inc.

Black Decker Inc.

Dalton Dawkins

Grzegorz J Kwiatkowski

Joshua M Hooks

Lara Kudryk-Traska

Jeffrey B Pasquino

Richard B Lewis

Raymond D Brubaker

Stephen J Skeels

A system is provided including a current sensor arranged to sense current drawn by an electric motor of a powered device through an AC power line from a power supply and provide current data related to the powered device; a monitoring device arranged to receive the current data from the electrical sensor, the monitoring device including a controller processing the current data to obtain performance data associated with the powered device, the performance data relating to load applied to the electric motor; a data communication device communicating with the monitoring device and arranged to receive the performance data associated with the powered device; and a computing device including a graphical user interface, the computer device receiving a user's selection of the powered device from a list of powered devices and presenting the performance data to the user via the graphical user interface in response to the user's selection.

System and apparatus for monitoring the performance of an electrically powered device

A thermal management system for use in a sealed communications module and associated systems and methods are disclosed herein. In some embodiments, the communications model includes a sealed housing and a circuit board assembly having one or more heat-generating electronic components positioned within the housing. The thermal management system is coupled to the circuit board assembly and positioned to disperse heat from the one or more electronic components. The thermal management system includes a first thermal pathway, a second thermal pathway, and a third thermal pathway. The first thermal pathway has a first end attached to the circuit board assembly and a second end positioned near the side wall of the housing. The second thermal pathway is coupled to the second end of the first thermal pathway. The third thermal pathway is coupled to the second end of the first thermal pathway.

Sealed communications module with multi-path thermal management system

A system for providing cooling to electronic modules received within a chassis. The chassis includes a cooling apparatus having ducting and a plurality of fans coupled to the ducting. The ducting includes air passageways that extend through the ducting and are configured to direct air blown into the passageways by the fans toward the modules installed in the chassis. The modules include heat sinks and the air passageways direct the air toward the fins to provide cooling to the heat sinks. The chassis includes switches coupled to the fans and configured to selectively activate the individual fans when the electronic modules are installed in the chassis.

Air cooling system for modular electronic equipment

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Portland, OR, United States of America

Dalton Dawkins