American Cyanamid Company

American Cyanamid

Dalip K Kohli

David W Wang

Kevin R Hirschbuehler

Michael M Fisher

Daniel R Draney

Jeanne L Courter

Martin Hauser

Novel aromatic ether ketone diamine compounds and methods for their preparation are disclosed which comprise from about 3 to 8 aromatic rings interspersed with ether and ketone linkages. The novel ether ketone diamine compounds are useful as monomeric starting materials for the preparation of useful intermediates and useful thermoplastic and high temperature resistant polymers. In preferred embodiments, the novel ether ketone diamines are useful as curing agents for epoxy resin compositions and composite materials.

Aromatic ether-ketone polyamines, intermediates and products, and

N,N'-dimethyl aromatic diamines are prepared from the corresponding diprimary amines via a two step synthesis forming first the corresponding di-succinylimidomethylamine and then reductively cleaving the succinylimido group. The products are useful, e.g., as epoxy curing agents.

Process for the preparation of N,N'-dimethyl aromatic diamines,

A method for making polyimide polymers is provided by effecting reaction between an aliphatically unsaturated imide, such as maleimide, formaldehyde, and an organic polyamine, for example trimethylene bis(4-aminobenzoate), for example in refluxing ethanol. The polyimides produced by the simple one-step method are pure, and exhibit superior toughness, and reduced shrinkage upon cure by heating. The new product are useful as molding compounds, laminating resins, and the like, being especially suitable for airplane parts, advanced composites, high performance adhesives and printed circuit boards.

Method for making polyimides and products produced thereby

Bis-N-succinimidyl methylamino aromatic compounds

New and improved heat curable compositions are disclosed comprising epoxidic prepolymers and mono- and di-imidazole-carboxamides. The compositions are stable at room temperature, but cure readily at moderate temperatures of substantially less than about 250.degree. F., preferably at about 180.degree. F. to about 200.degree. F. and especially preferably at about 160.degree. F. to about 180.degree. F. The cured neat resins are useful as adhesives and as matrix resins in reinforced composites, with excellent physical properties.

Epoxy resin compositions curable above 160 F. and below 250 F.

New and improved heat curable compositions are disclosed comprising epoxidic resin(s) and aromatic ether-sulfone polyamines, alone or in combination with other diamine curing agents and/or curing catalysts alone, or in further combination with reinforcements, e.g., graphite fibers and, optionally modified with second resins. The cured neat resins and fiber resin matrix compositions exhibit high toughness, compression strength and short beam shear strength under dry, wet and hot/wet conditions.

Curable epoxy resin compositions

Curable compositions are provided comprising epoxide prepolymers and polyaminobenzoates, alone, or combined with reinforcements, e.g., graphite fibers, and, optionally modified with second resins. The cured fiber resin matrix compositions exhibit high toughness combined with excellent hot/wet strength.

Alkyleneglycol-bis(4-methylaminobenzoates)

Curable compositions comprising epoxide prepolymers and polyaminobenzoates, alone, or combined with reinforcements, e.g., graphite fibers, and, optionally modified with second resins. The cured resin fiber matrix compositions exhibit high toughness combined with excellent hot/wet strength.

Polyimide from unsaturated imide, polyamine and aldehyde

Curable compositions comprising substituted bisurea catalyzed epoxide prepolymers alone, or with aromatic polyamine curing agents, alone, or in further combination with reinforcements, e.g., graphite fibers, and optionally modified with second resins are disclosed. The cured resin fiber matrix compositions exhibit high toughness combined with excellent hot/wet strength.

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Norwalk, CT, United States of America

Dalip K Kohli