Motorola Corporation

Other

Motorla, Inc.

Dale W Dorinski

Anthony B Suppelsa

Glenn F Urbish

David E Reiff

Thomas J Swirbel

Mac W Branan

Robert W Pennisi

William B Mullen, Iii

Frank J Juskey, Jr

Bruce J Freyman

Stephen D Hunt

John D Shurboff

Martin J McKinley

Quirino Balzano

Rudy Yorio

Leng H Ooi

Mark S Bresin

Barry M Miles

Anthony J Suppelsa

Douglas W Hendricks

Stephen M Stanton

Charles E Kline

Jill C Olkoski

Leonard F Altman

William M Bradford

Mac W Branan, Jr

Danielle P Dzung

M William Branan, Jr

Gerald W Blanton

Robert W McGinnis

John A Desantis

Frank M Scutch, Iii

Lynne J Giacomino

John A Stoutland

A security system (300) for a personal computer maintains computer terminal (302) in an active mode of operation while the user is within range of the terminal. The system includes a radio (314) worn by a user (316) which generates a low level RF signal (318). As long as the user (316) remains within range of the computer (302), a receiver (312) will detect a received signal strength which maintains the computer monitor (306) in an active mode of operation. When the user (316) walks away from the computer terminal (302), the received signal strength decreases below a threshold which causes the monitor (306) to go into a lock-out condition.

Security system for a personal computer

A solderless electrical interconnection is made using electrically conductive hook fasteners (15) that are embedded in a substrate (12). The upper part (20) of the fastener is exposed on the top side of the substrate, the central part (22) is embedded within the substrate itself, and the lower or hook portion (17) of the fastener protrudes from the bottom side of the substrate. Electrically conductive pathways (30), defined on the top side of the substrate, make contact with the exposed upper part of the hook fastener. The electrically conductive runners on the top side have a continuous signal path through the substrate to the bottom side of the substrate via the electrically conductive hook fastener. The hook fastener (15) is engaged to electrically conductive loop fasteners (60) on a second substrate (70) in order to create a solderless electrical interconnection and mechanical interlocking between the two substrates.

Solderless electrical interconnection including metallized hook and loop

A one-way optical communication system adapted for vehicular use. A light-readable indicia (35) is embedded in a window or mounted on an exterior portion of a moving motor vehicle (10). The indicia (15) is transparent to visible light and is reflective to infrared or ultraviolet light, making it generally invisible to the unaided human eye. A beam (30) of infrared or ultraviolet light located in a fixed position remote from the moving vehicle illuminates the indicia and portions of the beam are reflected from the illuminated indicia in a representative pattern. The reflected beam is detected by a fixed sensor (25), which provides an electrical signal. The signal is analyzed to determine the identity of the motor vehicle.

One-way optical highway communication system

A stepped pattern is formed in a photoresist film (10) by heating the photoresist at a first temperature to soft bake it, and then applying a mask (10) that allows only a selected portion (15) of the photoresist to be heated. That portion of the photoresist film is then heated at a temperature sufficient to partially degrade the photoresist, and the mask is removed. Another portion (22) of the photoresist film is then exposed to ultraviolet light to degrade it more fully than in the earlier step. The photoresist film is then developed under conditions sufficient to completely remove the portion exposed to ultraviolet light, and to partially remove the portion heated using the mask, thereby creating a stepped feature in the photoresist film.

Method for creating a pattern having step features in a photopolymer

A stepped pattern is formed in a photoresist film (10) by heating the photoresist at a first temperature to soft bake it, and then heating only a selected portion (15) of the photoresist. That portion of the photoresist film is then heated at a temperature sufficient to partially degrade the photoresist. Another portion (22) of the photoresist film is then exposed to ultraviolet light to degrade it more fully than in the earlier step. The photoresist film is then developed under conditions sufficient to completely remove the portion exposed to ultraviolet light, and to partially remove the portion heated in the first step, thereby creating a stepped feature in the photoresist film.

Method of forming a pattern with step features in a photopolymer

An assembly (5) has two or more plastic parts joined together. One of the plastic parts (20) has an electrical heating element (31) whose function is to soften a portion of the plastic when the heating element is electrically energized. Once the plastic is softened, the two parts can be separated and the assembly disassembled. When the two parts are joined together with snap-fit joints, the snap-fits have a heating element to soften a portion of the snap-fit (24) when the heating element is electrically energized, thereby allowing the housing to be opened and separated. If the two parts are ultrasonically welded together to form a housing, a heating element is located therein to soften the ultrasonically welded portion (44), thereby allowing the two halves of the housing to be separated. The heating element can be a nichrome or thin film resistor that is energized by a source (33) located within the housing, or by an power source external to the housing, or it may be inductively coupled to the power source.

Housing with integral opening feature

A portable battery charger (102) for use with a variety of battery packs (106) is capable of determining and applying the appropriate charge voltage and current. Electronic circuitry (128) within the portable battery charger identifies the type of battery pack to be charged and selects the appropriate set of battery banks (120) in the charger. Sensors (132) determine the state of charge of the battery pack and a controller (128) controls the functions of the charger. A multiplicity of connectors (314) on the portable battery charger are provided to allow connection to a variety of battery packs. The charger first identifies the type of battery pack and determines the charging profile to be used to charge the battery pack. The charging profile is set in the portable charger by selecting the appropriate sources of electrical power, and the battery pack is then appropriately charged.

Microprocessor controlled portable battery charger and method of

A liquid crystal display device (11) is made by sputtering a layer of indium-tin oxide and copper on a transparent substrate. This metal layer is photodelineated to form a pattern of electrodes (17) and heating elements (81), the heating elements being interlaced between the electrodes. The heating elements are converted to a more resistive form by applying a constant voltage signal to only the heating elements in an oxygen-containing atmosphere. The assembled LCD has the heating elements on the inside of the display, so that when the heating elements are pulsed, they heat only a portion of the liquid crystal fluid in the immediate proximity. The heaters are activated by a signal from a display driver.

Liquid crystal display with integral heater and method of fabricating

Housing with integral thin film resistive snap-fits

A multichip circuit package is formed for use with an EPROM chip. The active circuitry on the EPROM die surface is revealed. An EPROM die (14) is mounted on an insulating substrate (10). The active circuitry (15) on the die is connected to a conductive circuit pattern (13) on the substrate by wire bonds (16) between the die and the conductive circuit pattern. A second integrated circuit die (20) is also mounted on the substrate and electrically connected to the conductive circuit pattern by wire bonds. A plastic material (50) is then molded to encapsulate the perimeter (18) of the EPROM and the associated thin wires, the entire second integrated circuit die and it's associated thin wires, at least a portion of the conductive circuit pattern, and portions of the insulating substrate. The plastic material is formed so as to expose the active circuitry on the face of the EPROM.

Light erasable multichip module

An erasable programmable read only memory (EPROM) package whose storage information can be erased by irradiating with light of a certain wavelength. A semiconductor device (34) with an erasable programmable read only memory is mounted on a circuit carrying substrate (30). Synthetic resin (37) covers the semiconductor device and portions of the circuit carrying substrate to provide a package. A window (39) is formed in the resin to expose the erasable-programmable-read-only-memory circuit to light. The window is cross-polarized and normally opaque to the light and transmits the light when appropriately energized to remove the cross polarization. The light is typically in the ultraviolet frequency, and the window may be made from a liquid crystal material or a solid crystal material such as PLZT. Applying a voltage to the window causes the liquid crystal material in the window to become transparent and allow the EPROM to be erased.

EPROM package and method of optically erasing

An integral electric switch, for controlling an electronic apparatus, comprises a main housing and a flap portion, rotatably attached thereto. The main housing contains the electronic apparatus. The flap portion has a hinge cam for rotatably attaching the flap portion to the main housing, so that the flap portion is movable from a defined open position to a closed position with respect to the main body. The main housing comprises a plurality of spring fingers making sliding contact with the hinge cam as the flap portion is rotated from the open position to the closed position thus providing a switching function and electrical connection from the housing to devices contained within the flap.

Integral spring loaded hinge and switch for portable radio device

A three-dimensional printed circuit assembly is formed by first making a substrate (20). A substrate (20) is first formed from a photoactive polymer (14) that is capable of altering its physical state when exposed to a radiant beam (30). At this point, the substrate is only partially cured. A conductive circuit pattern (50) is then formed on the partially cured substrate. The substrate is then molded to create a three-dimensional structure, and then further cured to cause the photoactive polymer to harden.

Method of forming a three-dimensional printed circuit assembly

A method for producing a three dimensional plastic article having an insert. The three dimensional plastic article (20) is formed by exposing a liquid photopolymer or other material (14) capable of selective solidification or curing to a source of energy (10), preferably a laser beam (30). A portion of the three dimensional plastic article is formed by selectively exposing portions of the surface (12) of the liquid photopolymer to the laser beam. The insert (26) is placed onto the partially formed article (20), and the remainder of the article is formed by selectively exposing additional portions of the surface (16) of the liquid polymer to the laser beam, creating successive layers, whereupon a plurality of the layers form the three dimensional article (20). The insert (26) becomes an integral part of the completed three-dimensional article.

Method of manufacturing a three-dimensional plastic article

A manufacturing process for a multilayer thermoplastic printed circuit substrate (200) begins with a thermoplastic core substrate (202) having a printed circuit pattern (204) on a surface (202A) of the core substrate. Either fully reacted or partially reacted thermoplastic material is dissolved in a suitable dissolving agent and then applied in the liquid state over the surface (202A) of the core substrate. Application is by spraying, dipping, spinning or rolling. This results in a layer of liquid thermoplastic material covering the printed circuit pattern on the core substrate. The dissolving agent is then removed from the thermoplastic layer, leaving behind a uniform, dry hard, dielectric film of thermoplastic resin (206). Using photolithographic techniques, a via (206A) is opened up in the dielectric layer. If the starting material for the dielectric layer was partially reacted thermoplastic resin, the dielectric layer is now fully cured. A second printed circuit pattern (208) is then applied over the dielectric layer and into the via, thereby forming a conductive through-hole, which connects the two printed circuit patterns.

Growing community of inventors

Coral Springs, FL, United States of America

Dale W Dorinski