Versiv Composites Limited

Saint-gobain Performance Plastics Corporation

Dale Thomas

Gerard T Buss

Jennifer Adamchuk

Sethumadhavan Ravichandran

Meghann White

The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of at not greater than about 10 microns.

Dielectric substrate and method of forming the same

The present disclosure relates to a copper-clad laminate that may include a copper foil layer, a fluoropolymer based adhesive layer overlying the copper foil layer, and a dielectric coating overlying the fluoropolymer based adhesive layer. The dielectric coating may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The dielectric coating may have an average thickness of not greater than about 20 microns.

Copper-clad laminate and method of forming the same

The present disclosure relates to a dielectric substrate that may include a polymer based core film, and a fluoropolymer based adhesive layer. The polymer based core film may include a resin matrix component, and a ceramic filler component. The ceramic filler component may include a first filler material. The particle size distribution of the first filler material may have a Dof at least about 1.0 microns and not greater than about 1.7, a Dof at least about 1.0 microns and not greater than about 3.5 microns, and a Dof at least about 2.7 microns and not greater than about 6 microns.

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Rochdale, United Kingdom

Dale Thomas