Kyocera Corporation

Kabushiki Kaisha Toyota Jidoshokki

Daizo Kamiyama

Hidehito Kubo

Shogo Mori

Masahiko Kimbara

Keiji Toh

Haruo Takagi

Yoshitaka Iwata

Kenji Tsubokawa

Hideo Tanimoto

Shinichi Soga

In a laminating direction of first to fifth ceramic sheets, a first slit and a second slit are positioned closer to a first mounting section and a second mounting section than a first communication hole, a second communication hole, a third communication hole and a fourth communication hole. Moreover, an overlapping section where each first slit and the first communication hole overlap, and an overlapping section where each second slit and the third communication hole overlap, are positioned in the vicinity of an area where the first mounting section and the second mounting section are disposed when viewed from the laminating direction of the first to fifth ceramic sheets.

Heat dissipation device and semiconductor device

A semiconductor apparatus includes a semiconductor device, a cooler of a forced cooling type, and a heat mass. Heat generated in the semiconductor device is conducted to the cooler. The heat mass comes into junction with the semiconductor device with solder so as to be thermally combined with the semiconductor device. The heat mass functions also as an electrode.

Semiconductor apparatus and manufacturing method thereof

Growing community of inventors

Kariya, Japan

Daizo Kamiyama