Sekisui Chemical Co., Ltd.

Daizo Ii

Juichi Fukatani

Hirofumi Kitano

Hideyuki Takahashi

Motokuni Ichitani

Yukio Ochitani

Katsuaki Sakashita

It is an object of the present invention to provide an interlayer film for laminated glass containing gallium-doped zinc oxide fine particles as heat shielding fine particles and exhibiting a high transparency and an excellent heat shielding performance. The present invention is an interlayer film for laminated glass, which comprises gallium-doped zinc oxide fine particles, a plasticizer, a dispersant, and a thermoplastic resin, wherein the gallium-doped zinc oxide fine particles have a hexagonal crystalline structure and a c-axis crystal lattice constant of 0.5207 nm or more, and a visible light transmittance Tof 70% or more and an infrared transmittance Tof less than 75% are obtained from measurement by the method according to JIS R 3106 performed on laminated glass obtained by interposing the interlayer film for laminated glass between a pair of 2.5 mm-thick clear glass sheets.

Interlayer film for laminated glass, laminated glass, and method of producing interlayer film for laminated glass

It is the object of the present invention to provide a binder resin for coating paste, comprising a polyvinyl acetal type resin, having an excellent dispersibility of inorganic powder such as conductive powder, ceramic powder and glass powder and being capable of exerting an extremely excellent coating property, particularly a printing property, when dispersing the inorganic powder to form paste, conductive paste, ceramic paste and glass paste. in the formulas, Rrepresents a straight chain or branched alkyl group having 1 to 20 carbon atoms, and Rrepresents hydrogen, a straight chain, branched or cyclic alkyl group having 1 to 20 carbon atoms, or an aryl group; and n represents an integer of 1 to 8; and further in the modified polyvinyl acetal resin, a content of the structural unit represented by the general formula (3) is 1 to 20 mol % and a content of the structural unit represented by the general formula (4) is 30 to 78 mol %.

Binder resin for coating paste

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Osaka, Japan

Daizo Ii