Matsushita Electric Industrial Co., Ltd.

Daizo Ando

Kunihiko Oishi

Tadashi Nakamura

Shinji Umeda

Syuji Kondo

An improved hermetically sealed case for enclosing an electronic element, wherein the case has an upper portion and a lower portion connected together by atomic bonding. The upper portion includes through holes. Each hole forms a lead to provide a connection from the outside of the case to the element within the case. Each lead is arranged in the through hole to seal the hole hermetically and yet provide an electrical contact for the element. The sealed case prevents the electronic element from being deteriorated by hazardous gas generated by the conventional welding process used to seal such cases.

Electronic component and method of fabricating same

An electronic element which is free of many of the impurities that tend to adversely affect its operation. The electronic element is hermetically sealed in a space formed by a framework having a first and second plate directly joined to its sides. Directly joining the first and second plates to the framework prevents splashes of adhesive and soldering material from effecting the operation of the electronic element.

Growing community of inventors

Katano, Japan

Daizo Ando