Shin-etsu Chemical Co., Ltd.

Daiyu Okafuji

Masaki Takeuchi

Hiroyuki Yamazaki

Daijitsu Harada

Masao Ando

Harunobu Matsui

An imprint mold-forming substrate is manufactured by providing a starting imprint mold-forming substrate () having a patterned portion () and a non-patterned portion (), providing a table () having a recess (), bonding the substrate () to the table () such that the patterned portion () is received in the recess () of the table to define a space region () between the patterned portion () and the table () such that the patterned portion is not in direct contact with the table, and performing contour machining on the substrate () secured to the table ().

Manufacturing of imprint mold-forming substrate

A rectangular substrate is prepared by providing a starting rectangular substrate having front and back surfaces and four side surfaces as ground, and pressing a rotary polishing pad perpendicularly against one side surface under a constant pressure, and relatively moving the rotary polishing pad and the substrate parallel to the side surface, for thereby polishing the side surface of the substrate. In the imprint lithography, the rectangular substrate is capable of controlling compression and pattern shape at a high accuracy and thus transferring a complex pattern of fine feature size to a recipient.

Rectangular substrate for imprint lithography and making method

A synthetic quartz glass cavity member () is bonded to a substrate () having an optical device () mounted thereon such that the device may be accommodated in the cavity member. The cavity member () has an inside surface consisting of a top surface () opposed to the device () and a side surface (). The top surface () is a mirror surface and the side surface () is a rough surface.

Synthetic quartz glass cavity member, synthetic quartz glass cavity lid, optical device package, and making methods

In an imprint mold-forming synthetic quartz glass substrate () of rectangular shape having dimensions Land Lwith L&#x2265;L, a circular region is delineated on the substrate back surface by a circle of radius R with L&#x2212;2R&#x2265;10 mm. When approximation analysis is performed from the 1st to 8th term in the Zernike polynomials on the circular region, a coefficient of the 4th term is equal to or greater than &#x2212;(2R/100,000&#xd7;1) &#x3bc;m.

Imprint mold-forming synthetic quartz glass substrate

An electronic grade glass substrate is provided with a recess, channel or step in one surface, and a first chamfer between the side surface of the recess, channel or step and the one surface. The side and bottom surfaces of the recess, channel or step are mirror finished, and the first chamfer is mirror finished.

Electronic grade glass substrate and making method

A rectangular substrate is used as a mold after it is provided with a topological pattern. The substrate has A-side and B-side opposed surfaces, the A-side surface being provided with the topological pattern. The A-side surface includes a central rectangular region of 1 to 50 mm by 1 to 50 mm having a flatness of up to 350 nm. Use of the mold-forming substrate prevents the occurrence of a pattern misalignment or pattern error between the step of forming a pattern on a mold-forming substrate and the transfer step. Transfer of a fine size and complex pattern is possible.

Rectangular mold-forming substrate

An electronic grade synthetic quartz glass substrate is manufactured by machining a synthetic quartz glass substrate to form a recess, channel or step and polishing the bottom and side surfaces of the recess, channel or step to mirror finish by a working portion of a rotary polishing tool while keeping the working portion in contact with the bottom and side surfaces under independent constant pressures.

Method for manufacturing electronic grade synthetic quartz glass substrate

An electronic grade synthetic quartz glass substrate having a recess, channel or step is manufactured by machining at least one surface of a synthetic quartz glass substrate having a maximum birefringence of up to 3 nm/cm in its entirety to form a recess, channel or step, and removing the residual stress due to machining.

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Joetsu, Japan

Daiyu Okafuji