Canon Kabushiki Kaisha

Mitsubishi Electric Corporation

Hitachi, Ltd.

Tdk Corporation

Komatsu Corporation

Ricoh Company, Ltd.

Maxell, Ltd.

Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Heavy Industries Limited

Mitsubishi Materials Corporation

Other

Sony Group Corporation

Hitachi Metals, Ltd.

Hitachi-kokusai Electric Inc.

Clarion Co

Daisuke Yoshida

Hirofumi Totsuka

Seiji Hashimoto

Takashi Muto

Yasushi Matsuno

Hideo Kobayashi

Yuji Yoshitomo

Takahiro Shirai

Toru Yamashita

Fumihiro Inui

Hirokazu Otani

Takeru Suzuki

Atsushi Furubayashi

Kohichi Nakamura

Hiroaki Ito

Tomohito Mori

Toru Koizumi

Kazuhiro Sonoda

Masato Kimura

Haruhiko Kohyama

Tetsuya Itano

Katsuhito Sakurai

Ikuo Okada

Yoichi Wada

Yoshiaki Takada

Yoshitaka Uemura

Hirotomo Sai

So Hasegawa

Takanori Matsui

Yuki Takahashi

Masahiro Kobayashi

Shigetoshi Sugawa

Kazunori Watanabe

Daisuke Kobayashi

Junji Shiokawa

Osamu Koyama

Katsumi Kurematsu

Toshihiro Iguchi

Kazuyuki Shigeta

Junya Kosaka

Keisuke Inata

Masaru Takahashi

Shigeki Kondo

Takayuki Ishii

Makoto Ise

Keiichi Serizawa

Shinichiro Hirooka

Yasuji Ikeda

Kohei Matsumoto

Teiichirou Chiba

Katsuhiko Horinouchi

Hiroshi Johno

Masao Hagiwara

Koichi Sono

Shinya Nakano

Masaki Taneike

Yu Katase

Kazuhiro Saito

Toshio Kameshima

Hidekazu Takahashi

Mamoru Miyawaki

Katsuro Takenaka

Hiroki Hiyama

Tomoyuki Yagi

Masaki Sato

Kazuo Yamazaki

Keigo Yokoyama

Hiroki Sato

Takeshi Akiyama

Tsuyoshi Tanaka

Shinichi Yamashita

Tomokazu Murakami

Sho Sato

Yuji Tsushima

Koichiro Iwata

Makoto Endo

Naoki Hamanaka

Noriyuki Shikina

Tadashi Fukuda

Daisuke Ueda

Shintaro Takenaka

Takeshi Yamakawa

Kazunori Oshima

Tatsuya Hayashi

Keitaro Uehara

Hironori Komi

Toshihiro Nishisaka

Akihito Nishizawa

Yasuharu Ota

Hirobumi Tanaka

Hidetoshi Hayashi

Yusuke Yatabe

Shogo Murosawa

Isao Karube

Tsutomu Usui

Hidetaka Oguma

Tetsuya Nakayama

Masakazu Moritoki

Yuichi Nonaka

Shuichi Tanigaki

An electronic device includes an element body. The element body includes at least two internal electrode layers and a dielectric layer laminated between the internal electrode layers. Ni oxide particles exist at a boundary between the internal electrode layers and the dielectric layer. The dielectric layer is in contact with the internal electrode layers at first and second boundaries. The dielectric layer includes a first dielectric large particle and a second dielectric large particle. The first dielectric large particle is in contact with at least one of the Ni oxide particles existing at the first boundary and in contact with one of the internal electrode layers at the second boundary. The second dielectric large particle is in contact with at least one of the internal electrode layers at the first boundary and in contact with at least one of the Ni oxide particles existing at the second boundary.

Electronic device

An electronic device includes an element body. The element body includes a first internal electrode layer, a second internal electrode layer, and a dielectric layer laminated between the first internal electrode layer and the second internal electrode layer. Ni oxide particles exist at a first boundary between the first internal electrode layer and the dielectric layer. The dielectric layer includes a dielectric large particle in contact with both of the Ni oxide particles at the first boundary and the second internal electrode layer.

A semiconductor apparatus according to the present invention includes: a semiconductor component including a cell array and a plurality of wirings; and a semiconductor component including a plurality of pads connected to the semiconductor component including the cell array. A first row pad connected to a row wiring connected to a first cell and a second cell, a second row pad connected to a row wiring connected to a third cell and a fourth cell, and a column pad connected to a column wiring connected to the first cell and the third cell are arranged such that a straight line connecting the first row pad and the column pad crosses a straight line connecting the second row pad and the column pad.

Semiconductor apparatus and equipment

A photoelectric conversion device includes a pixel array and a reading unit including a plurality of reading circuits each configured to read a signal from the pixel array. Each reading circuit includes a sample-and-hold unit including a first sample-and-hold circuit configured to hold a reset level output from the pixel array and a second sample-and-hold circuit configured to hold a photo signal level output from the pixel array. The plurality of reading circuits include first reading circuits forming a first group and second reading circuits forming a second group. At least some of the plurality of first reading circuits are controlled by a first control signal given via a first control line, and at least some of the plurality of second reading circuits are controlled by a second control signal given via a second control line.

Photoelectric conversion device, photoelectric conversion system, and moving body

Provided is a signal processing device including a first substrate, a signal generation circuit arranged in the first substrate and configured to generate a reference signal to be used for comparison with a signal output from a pixel, a circuit element arranged in the first substrate and different from the signal generation circuit, and a contact region in which a contact connecting the first substrate and a wiring layer arranged over the first substrate is arranged. In a plan view with respect to the first substrate, the contact region is arranged between the signal generation circuit and the circuit element.

Signal processing device

Pixels output a first signal based on signal charge of a part of photoelectric conversion units of multiple photoelectric conversion units, and a second signal based on signal charge of multiple photoelectric conversion units. An imaging apparatus outputs signals based on the first signals and signals based on the second signals by reducing the number of signals based on the first signals as compared to the number of signals based on the second signals.

Imaging apparatus, and imaging system having a plurality of pixels for outputting a signal based on a generated signal charge

The disclosed apparatus includes a plurality of differential transmitters, and a power supply circuit that supplies a power supply voltage to each of the plurality of differential transmitters. The power supply circuit includes a common circuit unit that defines the power supply voltage supplied to the plurality of differential transmitters, and a plurality of individual circuit units provided in association with the plurality of differential transmitters and each connected to the common circuit unit. Each of the plurality of individual circuit units has an output node that outputs the power supply voltage defined by the common circuit unit to a corresponding differential transmitter of the plurality of differential transmitters, and respective output nodes of the plurality of individual circuit units are connected to each other.

Apparatus, power supply circuit, photoelectric conversion device, imaging device and movable object

A multilayer capacitor includes an element body haying a pair of end surfaces, and a pair of side surfaces and a pair of main surfaces; and a pair of external electrodes. The element body includes an inner layer portion in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked in a second direction where the pair of main surfaces face each other, and a pair of outer layer portions disposed outside the inner layer portion in the second direction. On at least one of the pair of end surfaces, the internal electrode of the inner layer portion protrudes outward in the first direction from the outer layer portion by a predetermined protrusion amount. A ratio of the protrusion amount to a dimension of one outer layer portion in the second direction ranges from 96,000 ppm to 176,000 ppm.

Multilayer capacitor

A work supporting apparatus includes: a visible light camera (visible light image photographing unit) configured to photograph a visible light image; a far-infrared camera (thermal image photographing unit) configured to photograph a thermal image; a work progress status determining unit configured to determine a work progress status from the visible light image photographed by the visible light camera and the thermal image photographed by the far-infrared camera; and a display configured to display a determination result of the work progress status.

Work supporting apparatus and work supporting system

An electronic apparatus is capable of reducing the startup time period of a device requiring initialization while suppressing power consumption of a battery. The electronic apparatus includes a main controller, a sub controller, a battery, a power reception controller configured to extract electric power from radio waves, and a power supply controller configured to control supply of electric power from the battery or the power reception controller to the sub controller. The main controller controls supply of electric power to the power supply controller such that electric power is supplied from the battery in a power-on mode in which power consumption of the electronic apparatus is large, and switches the power supply source to the power reception controller when the electronic apparatus shifts to a power-off mode in which the power consumption is smaller than in the power-on mode.

Electronic apparatus capable of reducing startup time period of devices, method of controlling same, and storage medium

A multilayer capacitor includes an element body, and a pair of side surfaces and a pair of main surfaces; and a pair of external electrodes. The element body includes an inner layer portion in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked in a second direction where the pair of main surfaces face each other, and a pair of outer layer portions disposed outside the inner layer portion in the second direction. On at least one of the pair of end surfaces, the internal electrode of the inner layer portion protrudes outward in the first direction from the outer layer portion by a predetermined protrusion amount. A ratio of the protrusion amount to a dimension of the element body in the second direction ranges from 11,000 ppm to 16,000 ppm.

An imaging device includes a first transmission line connected to a plurality of bit memories, a plurality of second bit memories disposed outside the memory area, and connected to the first transmission line, and each are configured to hold a digital signal of one bit that is one of different bits among a plurality of bits, a second transmission line connected to a part of the plurality of second bit memories, and a third transmission line connected to another part of the plurality of second bit memories.

Imaging device, imaging system, and moving body

Unmanned aerial vehicle

Growing community of inventors

Ebina, Japan

Daisuke Yoshida