Seiko Epson Corporation

Daisuke Yamada

Eiju Hirai

Motoki Takabe

Osamu Miyazawa

Yoichi Naganuma

Yoichiro Kondo

Yutaka Arakawa

Koichi Kamijo

Shingo Tomimatsu

Kiichi Kajino

Akio Konishi

Tomohisa Iwazaki

Yasuyuki Matsumoto

Shunsuke Watanabe

Shunya Fukuda

Shuichi Tanaka

Katsutomo Tsukahara

Shohei Mizuta

Tomokazu Kobayashi

Provided are an MEMS device, a liquid ejecting head, a liquid ejecting apparatus, a manufacturing method of a MEMS device, a manufacturing method of a liquid ejecting head and a manufacturing method of a liquid ejecting apparatus. Provided is a MEMS device that includes a first substrate on which a flexibly deformable thin film member is laminated, a second substrate disposed at an interval with respect to the first substrate, and an adhesion layer that adheres the first substrate to the second substrate, in which an end of the thin film member extends to the outside of the end of the first substrate in an in-plane direction of the first substrate.

MEMS device, liquid ejecting head, liquid ejecting apparatus, manufacturing method of MEMS device, manufacturing method of liquid ejecting head, and manufacturing method of liquid ejecting apparatus

A piezoelectric device (an actuator unit) includes the following: a first substrate (a pressure chamber forming substrate, a diaphragm) having a piezoelectric layer and a first wiring conductor (a top electrode layer) that is at least partially stacked on the piezoelectric layer; and a second substrate (a sealing substrate) having a second wiring conductor (a bottom wiring conductor) that faces and is separated from the first wiring conductor (a top electrode layer) and to which an electrical signal different from an electrical signal that is applied to the first wiring conductor (a top electrode layer) is applied. At least one of the first wiring conductor (a top electrode layer) and the second wiring conductor (a bottom wiring conductor) is at least partially covered with an electrically insulating protective layer.

Piezoelectric device, MEMS device, liquid ejecting head, and liquid ejecting apparatus

There is provided a liquid discharge head including a first wiring through which a drive signal is input to a wiring substrate, in which the wiring substrate has a substrate having a first surface and a second surface that opposes the first surface, a second wiring formed on the first surface, a third wiring formed on the second surface, a fourth wiring and a fifth wiring that pass through the substrate and electrically couples the second wiring with the third wiring, and an electrode provided on the second wiring and electrically couples the second wiring with the first wiring, and the electrode is positioned between a first coupling point at which the fourth wiring is electrically coupled to the second wiring and a second coupling point at which the fifth wiring is electrically coupled to the second wiring, in the second wiring.

Liquid discharge head having a wiring substrate with surface wirings connected at both ends via through-wirings

A liquid ejecting head includes a driving circuit configured to output a driving pulse; and a wiring substrate including a base body portion disposed between a flow path formation portion and the driving circuit, and a signal wiring formed on the base body portion and configured to transmit a driving signal for use in generation of the driving pulse by the driving circuit to the driving circuit from an input terminal. The signal wiring includes a first portion overlapping, in a plan view, at least one coupling terminal included in the driving circuit and coupled to the signal wiring, and a second portion located on the side of the input terminal when seen from the first portion, and the total number of wirings constituting the second portion is larger than the total number of wirings constituting the first portion.

Liquid ejecting head, liquid ejecting apparatus, and wiring substrate

A MEMS device which includes an adhesive which adheres a first substrate and a second substrate to each other, in which a first space which includes an electrode, an individual electrode, a common electrode, a bump electrode, and a piezoelectric element and which is configured as a closed space which is isolated from an atmosphere by the first substrate, the second substrate, and the adhesive is disposed in a space between the first substrate and the second substrate, and in which a second space which does not include any of the electrode, the individual electrode, the common electrode, the bump electrode, or the piezoelectric element and which communicates with the atmosphere due to a through-hole which penetrates at least one of the first substrate and the second substrate is disposed in the space between the first substrate and the second substrate.

MEMS device, liquid ejecting head, liquid ejecting apparatus, and manufacturing method of MEMS device

In a plan view from a perpendicular direction to a surface of a wiring substrate on which a wiring is provided, a buried wiring, a connection wiring, and a terminal portion of an external wiring are formed at an overlapping position, in which a recessed portion is provided at a position corresponding to the buried wiring on a surface of the connection wiring on an opposite side to the wiring substrate, and in which, in a direction intersecting an extension direction of the wiring on the surface of the wiring substrate on which the wiring is provided, a width of the connection wiring is larger than a width of the buried wiring, a width of the terminal portion of the external wiring is larger than a width of the recessed portion, and the terminal portion is provided across the recessed portion of the connection wiring.

Liquid ejection head, liquid ejection apparatus, and electronic device

A piezoelectric driving device includes a vibrating plate, a first electrode, a piezoelectric layer, a second electrode layer provided above the vibrating plate. An active section is formed in a portion where the first electrode layer, the piezoelectric layer, and the second electrode layer overlap one another. The active section has a longitudinal direction and a latitudinal direction in plan view. At both ends in the latitudinal direction, ends of the first electrode layer are disposed in the same positions as ends of the wiring layer or further on the outer side than the ends, ends of the second electrode layer are disposed in the same positions as the ends of the wiring layer or further on the inner side than the ends, and the ends of the first electrode layer are disposed further on the outer side than the ends of the second electrode layer.

Piezoelectric driving device, motor, robot, and pump

A liquid ejecting head includes a drive element, a drive circuit that outputs a signal for driving the drive element, and a wiring board. The wiring board is provided with a power supply wire through which power is supplied to the drive circuit, a first drive signal wire through which a first drive signal is supplied to the drive circuit, and a second drive signal wire through which a second drive signal is supplied to the drive circuit and that is not electrically connected to the power supply wire and the first drive signal wire on the wiring board, each of the first drive signal wire and the second drive signal wire is provided with a buried wire that is buried in a groove, and the first drive signal wire and the second drive signal wire are different from each other in number of the buried wires.

Liquid ejecting head and liquid ejecting apparatus

A piezoelectric driving device includes a vibrating plate, and a piezoelectric vibrating body including a substrate, and piezoelectric elements provided on the substrate. The piezoelectric element includes a first electrode, a second electrode, and a piezoelectric body, and the first electrode, the piezoelectric body, and the second electrode are laminated in this order on the substrate. The piezoelectric vibrating body is installed on the vibrating plate so that the piezoelectric element is interposed between the substrate and the vibrating plate. A wiring pattern including a first wiring corresponding to the first electrode and a second wiring corresponding to the second electrode is formed on the vibrating plate, the first electrode and the first wiring are connected to each other through a first laminated conducting portion, and the second electrode and the second wiring are connected to each other through a second laminated conducting portion.

Growing community of inventors

Shiojiri, Japan

Daisuke Yamada