Mitsubishi Gas Chemical Company, Inc.

Daisuke Ueyama

Hiroshi Takahashi

Masanobu Sogame

Yoshihiro Kato

Kentaro Takano

Yoshinori Mabuchi

Chisato Saito

Hajime Ohtsuka

Eisuke Shiga

Katsuya Tomizawa

Tomo Chiba

Yoshihiro Nakazumi

Kentaro Nomizu

Shota Koga

Resin composition, prepreg, metal-foil-clad laminate, resin sheet, and printed circuit board

The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.

Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board

The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 &#x3bc;m to 100 &#x3bc;m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board

There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B)  wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.

Resin composition, and prepreg and laminated sheet using the same

The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.

Resin composition, prepreg and laminate

The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.

Resin composition, and prepreg and laminate using the same

A resin composition is provided which can be suitably used in a printed wiring board having high glass transition temperature, high copper foil peel strength, heat resistance in moisture absorption, flame resistance, resistance to soldering heat, low water absorption and high heat dissipation characteristics, and a prepreg using the resin composition, and a laminate as well as a metal foil-clad laminate using the prepreg. There is used a resin composition including an epoxy resin (A), a curing agent (B), a first filler (C), a second filler (D) and a wetting dispersant (E), wherein the first filler (C) is borate particles coated with hexagonal boron nitride.

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Tokyo, Japan

Daisuke Ueyama