Nitto-denko Corporation

Daisuke Uenda

Yoshio Terada

Yasuhiro Amano

Takeshi Matsumura

Hirofumi Fujii

Eiji Toyoda

Makoto Namikawa

Yukio Arimitsu

Akihisa Murata

Hiroyuki Yoshimi

Toshiki Naito

Takashi Yamaoka

Yuki Sugo

Akira Ohtani

Hitoshi Ishizaka

Koichi Inoue

Jirou Nukaga

Nobuaki Maruoka

Yusaku Shimizu

Miki Morita

Yoshifumi Shinogi

Tsuyoshi Torinari

Asami Funatsu

A thermosetting resin sheet for sealing an electronic component, that is excellent in adhesiveness, onto the electric component; a resin-sealed type semiconductor device high in reliability; and a method for producing the device are provided. The present invention relates to a thermosetting resin sheet for sealing an electronic component, comprising one or more resin components, one of the components being allowable to be a thermoplastic resin, and having a content by percentage of the thermoplastic resin of 30% or less by weight of all of the entire resin components.

Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device

An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.

Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

Cleaning sheet, transfer member provided with cleaning function, and method for cleaning substrate processing apparatus

A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 &#x3bc;m or less and a maximum height Rz of 1.0 &#x3bc;m or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mmis 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mmas determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them

The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20&#xb0; C. up to 150&#xb0; C. being 5&#xd7;10Pa to 1&#xd7;10Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

Cleaning substrate of substrate processing equipment and heat resistant resin preferable therefor

A method for manufacturing a double-sided circuit board from a board material having a first electric conductor layer and a first electrically insulating layer, including the steps of: making conduction holes in the board material so as to penetrate only the first electrically insulating layer or both the first electrically insulating layer and the first electric conductor layer; forming an electrically conductive thin-film layer on a surface of the first electrically insulating layer and wall surfaces of the conduction holes; forming a second electrically insulating layer on the electrically conductive thin-film layer; forming a first electric conductor wiring by electroplating on predetermined portions of the electrically conductive thin-film layer; covering the first electric conductor wiring with a chemical-resistant film; forming a second electric conductor wiring by chemically dissolving a predetermined portion of another surface of the first electric conductor layer; and removing the second electrically insulating layer and the film.

Method of manufacturing double-sided circuit board

A liquid crystal cell substrate having a polarizing function is disclosed which can be extremely thin and lightweight and is excellent in heat resistance, impact resistance and quality stability. The liquid crystal cell substrate comprises a resin substrate and, closely adhered thereon, at least a gas barrier layer, a crosslinked resin layer and a polarizing layer, wherein the polarizing layer comprises a coating layer. This cell substrate, having a polarizing function and high durability, can be efficiently produced because an exceedingly thin polarizing layer having excellent heat resistance can be deposited on a resin substrate by coating and because a gas barrier layer and a crosslinked resin layer also can be easily formed. It is excellent in moisture resistance, gas resistance and impact resistance, can be extremely thin and lightweight, and has excellent heat resistance. With this liquid crystal cell substrate, a liquid crystal cell excellent in the long-term stability of display quality can be fabricated.

Growing community of inventors

Ibaraki, Japan

Daisuke Uenda