Tdk Corporation

Daisuke Tsuchida

Yo Saito

Kouki Yamada

Takehiko Abe

Yoshihiko Satoh

Shingo Yasuda

Makikazu Takehana

Yuki Ikeda

Koki Yamada

An NTC thermistor element includes a thermistor body and a plurality of internal electrodes disposed in the thermistor body and opposing each other. The thermistor body includes a region interposed between adjacent internal electrodes of the plurality of internal electrodes. The region of the thermistor body includes a plurality of crystal grains arranged in succession between the internal electrodes adjacent to each other. The plurality of crystal grains include a first crystal grain, a second crystal grain, and a third crystal grain. The first crystal grain is in contact with one internal electrode of the internal electrodes adjacent to each other. The second crystal grain is in contact with another internal electrode of the internal electrodes adjacent to each other. The third crystal grain is not in contact with the first crystal grain and the second crystal grain.

NTC thermistor element

An NTC thermistor element is of less than 0402 size. A first internal electrode is connected to a first external electrode. A second internal electrode is separated from the first internal electrode and is connected to a second external electrode. A third internal electrode opposes the first and second internal electrodes and is not connected to the first external electrode and the second external electrode. A shortest distance between the first internal electrode and the third internal electrode and a shortest distance between the second internal electrode and the third internal electrode are smaller than a shortest distance between the first internal electrode and the second internal electrode, a shortest distance between the first external electrode and the third internal electrode, and a shortest distance between the second external electrode and the third internal electrode, and are less than or equal to &#xbc; the thickness of the thermistor body.

A chip thermistorhas a thermistor portioncomprised of a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portionscomprised of a composite material of Ag&#x2014;Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portionso as to sandwich in the thermistor portionbetween the composite portions; and external electrodesconnected to the pair of composite portions, respectively. In this manner, the pair of composite portionsare used as bulk electrodes and, for this reason, the resistance of the chip thermistorcan be adjusted mainly with consideration to the resistance in the thermistor portion, without need for much consideration to the distance between the external electrodesand other factors.

Chip thermistor and method of manufacturing same

A chip thermistor includes a thermistor element body and a pair of outer electrodes. The thermistor element body has a pair of end faces opposing each other and a main face connecting the end faces to each other. The pair of outer electrodes are arranged on the pair of end faces, respectively. The pair of outer electrodes have a width in a direction intersecting the opposing direction of the pair of end faces made narrower with distance from the thermistor element body.

Chip thermistor

A chip thermistor has a thermistor portion including a ceramic material containing respective metal oxides of Mn, Ni, and Co as major ingredients; a pair of composite portions including a composite material of Ag&#x2014;Pd, and respective metal oxides of Mn, Ni, and Co and arranged on both sides of the thermistor portion so as to sandwich in the thermistor portion between the composite portions; and external electrodes connected to the pair of composite portions, respectively. In this manner, the pair of composite portions are used as bulk electrodes and, for this reason, the resistance of the chip thermistor can be adjusted mainly with consideration to the resistance in the thermistor portion without need for much consideration to the distance between the external electrodes and other factors.

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Tokyo, Japan

Daisuke Tsuchida