Sekisui Chemical Co., Ltd.

Daisuke Tottori

Tatsushi Hayashi

Kazutaka Shirahase

Reona Yokota

Tomoki Kunikawa

Provided is an insulating resin material capable of reducing surface roughness of the surface of a cured object, and, when a metal layer is formed on the surface of the cured object, increasing adhesive strength between the cured object and the metal layer. The insulating resin material of the present invention includes a thermosetting resin, a curing agent, a first inorganic filler surface-treated with a first silane coupling agent, and a second inorganic filler surface-treated with a second silane coupling agent. When absolute difference between SP values of a most-abundantly contained thermosetting resin and an organic group of the first silane coupling agent is defined as SP(A), and when absolute difference between SP values of the most-abundantly contained thermosetting resin and an organic group of the second silane coupling agent is defined as SP(B); (SP(A)&#x2212;SP(B)) is not smaller than 0.5 but not larger than 3.5.

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Ibaraki, Japan

Daisuke Tottori