Seiko Instruments Inc

Daisuke Terada

Keiji Sato

Kiyoshi Aratake

Masashi Numata

Takahiko Nakamura

Hitoshi Takeuchi

Takeshi Sugiyama

To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component () is formed by bonding together a base () made of glass and a lid (). Outer electrodes () and () are formed on a bottom surface of the base (), and the outer electrodes () and () are respectively connected to through electrodes () and (). The outer electrodes () and () each have a laminated structure of three CrAu layers, that is, from a Cr layer (first layer) to an Au layer (sixth layer). When the outer electrodes () and () are soldered onto a circuit board, the Au layers as the second, fourth, and sixth layers are dissolved into solder, whereas the Cr layers as the third and fifth layers, which hardly form an intermetallic compound with solder, are separated to remain in solder.

Electronic component and electronic device

In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base.

Electronic device and method of manufacturing the same

Growing community of inventors

Chiba, Japan

Daisuke Terada