Sumitomo Electric Industries, Limited

A.l.m.t. Corporation

Daisuke Takagi

Nobuo Shiga

Takeshi Sekiguchi

Kenjiro Higaki

Toshio Mizue

Sosaku Sawada

Yasushi Tsuzuki

Sadamu Ishidu

Hiromi Kurashima

Ichiro Tonai

Nobuyoshi Tatoh

Takeshi Irie

Ryoji Sakamoto

Shinya Nishina

Kazunori Kurima

Satoshi Ohe

A collective substrate has through-holes. The through-holes each have an interior surface including taper surfaces which are tapered as having an opening size progressively decreasing from a main surface and an external connection surface toward a minimum size hole portion. A semiconductor element mount includes an insulative member cut out of the collective substrate. An imaging device includes an imaging element mounted in a region surrounded by a frame which is bonded to the main surface of the insulative member and closed by a cover. A light emitting diode component includes a light emitting element mounted on the main surface of the insulative member with the minimum size hole portion of the through-hole being filled with an electrically conductive material, the light emitting element being sealed with a fluorescent material and/or a protective resin.

Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

A collective substrate () is produced by firing a ceramic green sheet and forming through-holes () in the resulting substrate. The through-holes () each have an interior surface including taper surfaces () which are tapered as having an opening size progressively decreasing from a main surface () and an external connection surface () toward a minimum size hole portion (). The taper surfaces () respectively form obtuse angles &#x3b8;, &#x3b8;with the main surface () and the external connection surface (). A semiconductor element mount (BL) includes an insulative member () cut out of the collective substrate (). An imaging device (PE) includes an imaging element (PE) mounted in a region surrounded by a frame () which is bonded to the main surface () of the insulative member () and closed by a cover (FL). A light emitting diode component (LE) includes a light emitting element (LE) mounted on the main surface () of the insulative member () with the minimum size hole portion () of the through-hole being filled with an electrically conductive material (), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE) includes the light emitting diode component (LE) mounted in a package ().

Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

An optical semiconductor module having a large endothermic amount of an electronic cooling element can be provided, even if the area of the bottom plate of a package is the same. A packageincludes two or more units of electronic cooling elementmounted therein. Each unit of the electronic cooling element is inserted through the space between inner jutsof ceramic feedthrough of the packageand a bottom plate, and is fixed to the bottom plate. The plural units of electronic cooling element are connected in series by one or more copper piece. The total area of junction between the two or more units of electronic cooling element and the bottom plate area of the packageoccupies 75% or more of the area of the bottom plate. Thus, the ratio of the area of junction between the bottom plate and the electronic cooling element as a whole to the area of the bottom plate of the package can be increased.

Optical semiconductor module and method of producing the same

The present invention relates to an optical module or the like having a structure which prevents the efficiency in a sleeve securing operation or optical characteristics from deteriorating and improves adhesion durability. In particular, a resin mold portion including an optical device in the optical module according to the present invention is processed into a shape which can directly irradiate the UV-curable resin introduced between the resin mold portion and the sleeve with ultraviolet rays, and a structure for restricting the flow of the resin changing into a flowing state during the sleeve securing operation or a structure for improving the adhesion durability of the sleeve is provided on at least one of the sleeve side and resin mold portion side.

Optical module

A light-emitting element is mounted on a first conversion element mounting portion prepared on a lead frame and resin-molded by using a mold. In this case, a focusing lens whose optical axis coincides with the major surface of the light-emitting element and a coupling portion in which a sleeve is fitted are integrally molded at once to mold a transmission section and an electronic circuit section. When these member are fixed in housings, and a ferrule holding an optical fiber is inserted in the sleeve fitted in a recess portion of the coupling portion, the optical fiber is optically coupled to the major surface of the light-emitting element. At this time, when the distal end portion of the sleeve is brought into contact with the abutment portion in the coupling portion, the end face of the optical fiber always coincides with the major surface of the light-emitting element, thereby realizing reliable optical axis alignment.

Optical data link and method of manufacturing the same

Optical receiver/transmitter module

It is an object of the present invention to provide a highly reliable optical module circuit board having a sufficient mechanical strength with respect to an external stress. An optical module circuit board according to the present invention includes a flexible printed circuit having at least a multilayered structure in which a layer containing a conductive metal interconnection is sandwiched between insulating layers, wherein the flexible printed circuit includes a main body portion having the multilayered structure, a first surface mounted with an electronic component, and a second surface opposite to the first surface, a neck portion having the multilayered structure and extending from one end of the main body portion, and a head portion positioned at a distal end of the neck portion extending from the one end of the main body portion, having the multilayered structure, and mounted with an optical operation element and a bypass capacitor, Particularly, the neck portion defines the positional relationship between the main body portion and the head portion so as to give the circuit board a sufficient mechanical strength.

Optical module circuit board having flexible structure

Growing community of inventors

Itami, Japan

Daisuke Takagi