Canon Kabushiki Kaisha

Daisuke Shimoyama

Masaki Kurihara

Masataka Ito

Tetsuo Takahashi

Akira Okita

Hiroaki Sano

Yojiro Matsuda

Etsuro Kishi

Hiroaki Naruse

Norifumi Kajimoto

Koji Ishizuya

Naoki Inatani

Kei Aoki

Nobutaka Ukigaya

Kyouhei Watanabe

Takayuki Sumida

Tomoyuki Tezuka

Yasuhiro Kawabata

Masao Ishioka

Mariko Furuta

Jun Iwata

A device comprising a first layer, a sealing layer and a resin layer stacked in that order and an organic layer arranged between the first layer and the sealing layer in a pixel region is provided. The first, sealing and resin layers have openings for exposing an electrode in a peripheral region. The sealing layer includes second and third layers each having a water permeability lower than the first layer, and a fourth layer arranged between the second layer and the third layer and having a defect density lower than the second layer. A step of the second layer arranged above the end of the opening of the first layer is covered with the fourth layer and a step of the third layer arranged above the end of the opening of the first layer is covered with the resin layer.

Organic device and method of manufacturing the same

The present invention provides a light-emitting device including a substrate, a first EL element, and a second EL element, the first EL element and the second EL element each including a lower electrode, an organic compound layer including a light-emitting layer, an upper electrode, and a color filter in this order from the substrate, and an insulating layer that covers an end portion of the lower electrode. A first color filter of the first EL element and a second color filter of the second EL element overlap each other when viewed in plan in an overlapping region, and an inclined portion closest to the first EL element among inclined portions of the insulating layer of the second EL element and the overlapping region overlap each other when viewed in plan.

Light-emitting device, display apparatus, and image pickup apparatus

A display device is provided. The device comprises light emitting elements and a protection layer. The light emitting elements include lower electrodes isolated by an insulator portion, an organic layer including a light emitting layer arranged on the lower electrodes, and an upper electrode covering the organic layer. The insulator portion includes a first portion arranged on the lower electrodes, and a second portion arranged between the lower electrodes. The protection layer covers the upper electrode, and is provided with an isolating portion that is arranged over the second portion and has a refractive index different from the protection layer. A height of an upper surface of a portion of the upper electrode arranged under the isolating portion is lower than a height of an upper surface of a portion of the upper electrode arranged over the first portion.

Display device including lower electrodes isolated by an insulator portion and method of manufacturing the same

A method for forming a color filter array includes a step of exposing a photosensitive color filter film, a step of forming a color filter array from the color filter film by developing the color filter film using a developer, and a step of cleaning the color filter array while rotating the color filter array and moving a nozzle for spraying fluid containing liquid and gas above the color filter array in a direction intersecting with an axis of the rotation. The method reduces variation in thickness of a color filter that is generated in the cleaning step.

Method for forming color filter array, method for manufacturing imaging apparatus, and imaging apparatus

A method of manufacturing a semiconductor apparatus, comprising forming a structure including an insulating layer on a substrate, and an electrode on the structure, forming an insulating first film covering the electrode and the structure, forming an opening in a projection, of the first film, formed by a step between upper faces of the electrode and the structure, to expose part of the upper face of the electrode as a first portion, forming a second film covering the first film and the first portion, forming a protective film in the opening by processing the second film, the protective film covering a side face defining the opening and the first portion and being not formed on an upper face of the projection, and forming a third film on the first film and the protective film by spin coating.

Method of manufacturing semiconductor apparatus

The present invention provides a solid-state imaging apparatus which has hollow portions provided around each of color filters and achieves the prevention of the peeling of each of the color filters. The solid-state imaging apparatus having a plurality of light receiving portions provided on a semiconductor substrate includes: a plurality of color filters arranged correspondingly to each of the plurality of light receiving portions; and hollow portions formed around each of the plurality of color filters, wherein each of the color filters has one peripheral part contacting with adjacent one or more of the color filters.

Solid-state imaging apparatus and method of manufacturing the same

To realize simplification of a process of forming hollow portions in a solid-state imaging apparatus, a plurality of light receiving portions is formed on a semiconductor substrate, and color filter layers as hollow portion forming layers are formed above the semiconductor substrate (FIG.A). A sealable layer for opening boundary portions of the color filter layers is formed on the color filter layers (FIG.B). Hollow portions are formed on side surfaces of the color filter layer by etching using the sealable layer as a mask (FIG.C). The sealable layer is heated and softened to connect mutually adjacent sealable layers to form a sealing layer for sealing the aperture regions of the hollow portions (FIG.D).

Manufacturing method of solid-state imaging apparatus

When forming a hollow portion between each color filter, in order to realize the formation of the hollow portions with a narrower width, a plurality of light receiving portions are formed on the upper surface of a semiconductor substrate, a plurality of color filters corresponding to each of the light receiving portions are formed above the semiconductor substrate, a photoresist is formed on each color filter, side walls are formed on the side surfaces of the photoresist, and a hollow portion is formed between each color filter by performing etching using at least the side walls as a mask.

Solid state image pickup apparatus and method for manufacturing the same

A color filteris formed above a semiconductor substrate SB, in an area above a predetermined light receiving portion among a plurality of light receiving portions. A sacrificial layeris formed on upper and side of the first color filter. Color filtersandare formed above the semiconductor substrate SB, in areas above other light receiving portions adjacent to the predetermined light receiving portion, to expose at least part of the upper surface area of the first color filteron the sacrificial layer. The sacrificial layeris etched to remove the upper and side areas of the color filteron the sacrificial layerto form hollow portionsbetween the color filterand the color filterand between the color filterand the color filter

A method of manufacturing a solid-state image sensor includes preparing a structure including a photoelectric converter formed in an image sensing region and a pad electrode formed in a pad region, forming a first organic film including a first organic portion arranged in the image sensing region of the structure in the image sensing region and the pad region, forming a color filter layer on the first organic portion, forming a second organic film in the image sensing region and the pad region, forming an inorganic film in the image sensing region and the pad region, and etching the inorganic film, the second organic film, and the first organic film so as to form an opening which communicates with the pad electrode.

Growing community of inventors

Yamato, Japan

Daisuke Shimoyama