Nichia Corporation

Daisuke Sato

Atsushi Hashizume

Masashi Ishida

Shimpei Maeda

Toshiki Nishihama

Tadayuki Kitajima

Tomohiko Hatano

A light emitting device includes: a base portion comprising: an upward-facing surface, and a frame defining an inner lateral surface; a plurality of semiconductor laser elements arranged on the upward-facing surface and surrounded by the frame; a cover portion supported by the frame and disposed above the plurality of semiconductor laser elements; and a protrusion extending from a lower surface of the cover portion toward the upward-facing surface. Light emitted from each of the plurality of semiconductor laser elements is incident on a lateral surface of the protrusion, passes through the protrusion, is reflected at the boundary surface, and is transmitted through the cover portion.

Light emitting device

A light emitting module includes a light emitting device, a heat dissipating plate, and a holder. The light emitting device has a light extraction window and a plurality of electrodes. The light emitting device is secured to the heat dissipating plate. The heat dissipating plate is secured to the holder. The holder includes a plurality of terminals respectively connected to the electrodes of the light emitting device. The heat dissipating plate includes an exposed portion exposed from the holder when viewed from a side of the light emitting module on which the light extraction window of the light emitting device is provided.

Light emitting module

A method of manufacturing a light emitting device, includes providing a light emitting element having an element upper surface, an element lower surface opposite to the element upper surface in a thickness direction of the light emitting element, and an element side surface between the element upper surface and the element lower surface. A wavelength converter having a converter lower surface is provided. The wavelength converter is joined to the light emitting element using an adhesive so that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface viewed along the thickness direction. The adhesive covers the element side surface and the exposed region.

Method of manufacturing light emitting device

A light emitting module includes a light emitting device including first to sixth electrodes and a holder including first to sixth terminals. An insulator body of the holder at least partially surrounds the light emitting device in a plan view with the light emitting device being interposed between a first inner edge and a second inner edge of the insulator body, and a third inner edge linking the first and second inner edges. The first terminal projects from a third inner edge and is connected to the first electrode. The second and third terminals project from the first inner edge and are connected to the second and third electrodes, respectively. The fourth terminal projects from the third inner edge and connected to the fourth electrode. The fifth and sixth terminals project from the second inner edge and are connected to the fifth and sixth electrodes, respectively.

A method for detecting abnormality in a light emitting device including a semiconductor laser element that is pulse-driven by pulse-control to emit excitation light, a wavelength conversion member including a phosphor and that emits fluorescent light by being irradiated with the excitation light, and a light receiving element disposed on a light extraction side of the wavelength conversion member and that detects the excitation light, the method includes: pulse-controlling an applied voltage with a pulse width shorter than a time from a start of voltage application until an optical intensity of light extracted from the wavelength conversion member reaches a maximum intensity, thereby pulse-driving the semiconductor laser element to achieve laser oscillation; measuring an optical intensity of the excitation light, or optical intensities of both the excitation light and the fluorescent light; and determining whether or not the optical intensity or the optical intensities falls within a prescribed range.

Light emitting device and method for detecting abnormality in light emitting device

A light emitting device includes a light emitting element, a wavelength converter, a light transmissive member, a light guider, and a light transmitting layer. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element such that the converter lower surface faces the element upper surface. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter has a converter upper surface. The light transmitting layer has a layer lower surface facing the converter upper surface. The converter upper surface is smaller than the layer lower surface.

Light emitting device having light guider

The light emitting device includes a light emitting element, a wavelength converter, and a light guider. The light emitting element has an element upper surface, an element lower surface, and an element side surface. The wavelength converter has a converter lower surface. The wavelength is provided to be connected to the light emitting element. The converter lower surface has an exposed region that does not face the element upper surface. The light guider guides light from the light emitting element to the wavelength converter. The light guider covers the element side surface and the exposed region. The wavelength converter includes first and second wavelength converter parts. The first wavelength converter part faces the element upper surface and has a first thickness. The second wavelength converter part does not face the element upper surface and has a second thickness thinner than the first thickness.

Light emitting device having first and second wavelength converter parts

A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.

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Anan, Japan

Daisuke Sato