Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Kubota Corporation

Matsushita Electric Industrial Co., Ltd.

Daisuke Sakurai

Norihito Tsukahara

Yoshihiko Yagi

Keigo Honda

Kazuhiro Nishikawa

Hiroaki Nakagawa

Yuji Fukuda

Shozo Ochi

Hiroshi Fujiwara

Kiyokazu Itoi

Kazuya Usirokawa

Takeru Tamari

Ryosuke Kinugawa

Yuji Yamashita

Masato Mori

Ryuki Nishimoto

Toshiya Tani

Masahiro Ono

Shigeaki Sakatani

Osamu Uchida

Hiroshi Sakurai

Jun Tomita

Hidenobu Nishikawa

Kiyomi Hagihara

Yuya Konishi

Yoshihiro Ebata

Takatoshi Osumi

Taisuke Shinohara

Michiro Yoshino

A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.

Semiconductor device and methods of manufacturing semiconductor device

A semiconductor element includes a plurality of microlenses provided on a main surface to collect light, a plurality of conductive electrodes provided on a back surface of the main surface, a photoelectric converter to which the light collected by the plurality of microlenses is guided, and a strain sensor provided on the same layer as the photoelectric converter to detect a strain. A solid-state imaging apparatus includes the semiconductor element, a transparent member, an adhesive layer that covers the plurality of microlenses and adheres to the transparent member, and a plurality of external connection electrodes electrically connected to the plurality of conductive electrodes, respectively.

Solid-state imaging apparatus including semiconductor element with photoelectric converter and strain sensors

A hydraulic system of a working machine includes a hydraulic pump to output a hydraulic fluid, at least one proportional valve to deliver the hydraulic fluid to a supply target, a valve body including the proportional valve, a heat-up fluid passage in the valve body and into which the hydraulic fluid flows, a switching valve switchable between an open position in which the hydraulic fluid passing through the heat-up fluid passage is supplied to a hydraulic device and a closed position in which the hydraulic fluid is not supplied thereto and the hydraulic fluid from the hydraulic device is to be returned, a controller to operate the switching and proportional valves, and a return circuit through which the hydraulic fluid flowing into the heat-up fluid passage is returned as a result of at least one of the switching and proportional valves being operated by the controller.

Hydraulic system of working machine

A working machine includes a machine body having a front-rear direction and a right-left direction perpendicular to the front-rear direction and having a rear part in the front-rear direction, a right side, and a left side opposite to the right side in the right-left direction. A boom has a front end part and a rear end part opposite to the front end part of the boom in the front-rear direction. The rear end part of the boom is rotatably supported at the rear part of the machine body. The front end part of the boom is to be connected to a working tool. An engine is mounted in the rear part of the machine body. A urea aqueous solution tank is provided on one side of the engine in the right-left direction and a rear side of the engine in the front-rear direction to store a urea aqueous solution.

Working machine

A solid-state imaging device includes a solid-state imaging element and a substrate fixed to the solid-state imaging element by a sealing resin on a surface on an opposite side of a light receiving surface of the solid-state imaging element, an outer edge of the substrate seen from the light receiving surface side of the solid-state imaging element is positioned within an outer edge of the solid-state imaging element and an outer edge of the sealing resin seen from the light receiving surface side of the solid-state imaging element is positioned within the outer edge of the solid-state imaging element. The sealing resin includes a first sealing resin and a second sealing resin not contacting the first sealing resin to seal the components.

Solid-state imaging device having electronic components mounted between a main substrate and an imaging element

A hydraulic system for a working machine includes a hydraulic actuator having a first fluid chamber and a second fluid chamber, an accumulator, an outputting fluid tube to output an operation fluid, and a switching valve to be switched between a first position and a second position. The first position allows the first fluid chamber and the second fluid chamber to be communicated with the outputting fluid tube and thereby allowing a floating operation. The second position allows the first fluid chamber and the accumulator to be communicated with each other, allows the second fluid chamber and the outputting fluid tube to be communicated with each other, and thereby allows an anti-vibration operation.

Hydraulic system for working machine

A working machine includes a machine body having a front and a rear opposite to the front in a front-rear direction and an engine mounted in the machine body. A selective catalytic reduction catalyst is provided in the machine body and connected to the machine body and connected to the engine. A fuel tank is provided in the machine body to supply fuel to an engine. A urea aqueous solution tank is to store a urea aqueous solution. The urea aqueous solution tank is connected to the selective catalytic reduction catalyst and provided in the machine body between the engine and the front of the machine body in the front-rear direction. A traveling device support body supports the right traveling device and the left traveling device. The machine body does not rotate with respect to the traveling device support body.

A method for manufacturing a semiconductor device includes: supplying a resist to a first surface of a semiconductor element having a plurality of electrode pads to cover the electrode pad surfaces; opening the resist on the electrode pad surfaces to expose the electrode pad surfaces from the resist; curing the resist by applying light or heat to the resist; forming bump electrodes on the electrode pad surfaces by filling a plating solution into the openings of the resist; and peeling the resist from the first surface of the semiconductor element.

Method for manufacturing semiconductor device

A hydraulic system for a working machine includes an fluid cooler including an input port and an output port, the fluid cooler being configured to cool an operation fluid, an outputting portion to output the operation fluid, a traveling hydraulic device to be activated by the operation fluid, an operating hydraulic device to be activated by the operation fluid, a first output fluid tube connecting the operating hydraulic device to a tank, a second output fluid tube branching from the first output fluid tube and being connected to the input port of the fluid cooler, a third output fluid tube connecting the outputting portion to the output port of the fluid cooler, a fourth output fluid tube connected to the traveling hydraulic device, the fourth output fluid tube being connected to the second output fluid tube, and a first check valve disposed on the fourth output fluid tube.

A working machine body includes a machine body having a front and a rear opposite to the front in a front-rear direction and an engine mounted in the machine body. A selective catalytic reduction catalyst is provided in the machine body and connected to the machine body and connected to the engine. A urea aqueous solution tank is to store a urea aqueous solution. The urea aqueous solution tank is connected to the selective catalytic reduction catalyst and provided in the machine body between the engine and the front of the machine body in the front-rear direction.

An optical module structure includes a main substrate, an interposer substrate electrically connected to the main substrate via a first protruding electrode, a first communication LSI electrically connected to the interposer substrate via a second protruding electrode, an IC element electrically connected to the interposer substrate via a lateral-surface connection terminal of the interposer substrate and via a third protruding electrode, an Si bench substrate electrically connected to the IC element via a fourth protruding electrode and via a lateral-surface connection terminal of the Si bench substrate, an optical element electrically connected to the Si bench substrate via a fifth protruding electrode, and an optical fiber optically connected via an optical waveguide formed on the Si bench substrate.

Optical module structure

A machine body has a front-rear direction and a right-left direction perpendicular to the front-rear direction. The machine body has right and left sides in the right-left direction. A cabin is mounted in the machine body between the right and left sides. Right and left traveling devices are arranged respectively on the right and left sides of the machine body. A boom has a front end part in the front-rear direction to be connected to a working tool. A first wall is provided on one side of the boom in the right-left direction. A second wall is provided on another side opposite to the one side with respect to the boom in the right-left direction. A urea aqueous solution tank is provided between the first and second walls to store a urea aqueous solution.

In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal () of an electronic component () and an electrode terminal () of a substrate () contains an alloy () and a metal () having a lower modulus of elasticity than the alloy (). The junction has a cross section structure in which the alloy () is surrounded by the metal () having the lower modulus of elasticity.

Mounting structure and manufacturing method for same

A plurality of protruding electrodes of a semiconductor chip are in contact with a plurality of electrodes formed on a semiconductor substrate, via a plurality of solder sections. In this state, the solder sections are melted so as to form a plurality of solder bonding sections joined to the protruding electrodes of the semiconductor chip and the electrodes of the semiconductor substrate. Moreover, a distance between a part of the semiconductor chip and the semiconductor substrate is larger than a distance between the other part of the semiconductor chip and the semiconductor substrate, extending at least some of the solder bonding sections. Thus, the solder bonding sections vary in height. Holes are then formed at least in a solder bonding section having a maximum height out of the solder bonding sections. After that, the solder bonding sections are solidified.

Growing community of inventors

Osaka, Japan

Daisuke Sakurai