Kyocera Corporation

Daisuke Sakumoto

Shingo Matsuura

Tamio Kusano

Kousuke Katabe

Yuki Mori

Akira Miyake

Mitsuo Yanagisawa

Tomoya Tabuchi

Mahiro Tsujino

Masakazu Yasui

Hiroki Itou

Masami Juta

Takeo Satake

Fumiaki Sekine

Daisuke Tanaka

Nobuyuki Takehashi

Mitsugu Uraya

Yuuki Mori

An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the grooves. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.

Insulating component, semiconductor package, and semiconductor apparatus

An insulating component includes an insulating substrate, a metal layer, a bond, and a lead terminal. The plate-like insulating substrate has a groove continuous from its upper to side surfaces. The metal layer includes a first metal layer on the upper surface of the insulating substrate and a second metal layer on an inner surface of the groove continuous with the first metal layer. The bond is on an upper surface of the metal layer. The lead terminal is on an upper surface of the first metal layer with the bond in between, and overlaps the groove. The bond includes a first bond fixing the lead terminal to the first metal layer and a second bond on an upper surface of the second metal layer continuous with the first bond. The groove includes an inner wall having a ridge. The second bond is between the ridge and the lead terminal.

A light-emitting device includes a wavelength conversion member including, in a dispersed manner, a first phosphor, a second phosphor, a third phosphor, a fourth phosphor, and a fifth phosphor, and a light emitter. The first phosphor has a peak in a wavelength region of 400 to 500 nm, the second phosphor in 450 to 550 nm, the third phosphor in 500 to 600 nm, the fourth phosphor in 600 to 700 nm, and a fifth phosphor in 680 to 800 nm. The light emitter emits light in an ultraviolet region of 380 to 430 nm. The light-emitting device has an emission spectrum in a region of 380 to 950 nm including peaks in regions of 380 to 430 nm, 430 to 480 nm, 480 to 550 nm, 550 to 650 nm, and 650 to 750 nm, and differences between relative light intensities at the peaks are less than 20%.

Light-emitting device and illumination apparatus

An indoor light source emits light having an emission spectrum including a first peak in a wavelength region of 440 to 460 nm, a second peak in a wavelength region of 540 to 560 nm, and a third peak in a wavelength region of 610 to 630 nm. When the highest one of intensities at the first peak, the second peak, and the third peak is 1 in terms of relative intensity, the emission spectrum includes a lowest light intensity of 0.7 or higher in terms of relative intensity in &#x3bb;1 to &#x3bb;2 in nm, and a lowest light intensity of 0.8 or higher in terms of relative intensity in &#x3bb;2 to &#x3bb;3 in nm, where &#x3bb;1 is a peak wavelength at the first peak in nm, &#x3bb;2 is a peak wavelength at the second peak in nm, and &#x3bb;3 is a peak wavelength at the third peak in nm.

Indoor light source and illumination apparatus

An electronic component housing package has an input/output member that is bonded to a hole part of a frame body via a brazing material. This input/output member has a top surface that is bonded to first side wall parts and a second side wall part inside the first side wall parts, and the top surface is provided with a narrow part having a narrow width at a portion that is bonded to the first side wall part. When the input/output member is bonded, the flow of the brazing material on the top surface can be controlled by the narrow part.

Electronic component housing package and electronic device

The invention relates to reducing effect of light that is emitted from a light-emitting element and then enters between a base and a frame member. A light-emitting device () includes a base (), a frame member () and a light-emitting element (). The light-emitting device () further includes an intervening layer (). The frame member () is disposed on the base (). The light-emitting element () is made of a semiconductor material. The light-emitting element () is disposed in a region defined by the frame member (), and mounted on the base (). The intervening layer () contains a plurality of light transmitting particles (-) and is disposed between the base () and the frame member ().

Light-emitting device

A light-emitting apparatus includes a substrate warped as a whole of which a central portion is most highly raised; a light-emitting device mounted on the central portion of the substrate; a support member disposed on the substrate so as to surround the light-emitting device; and a frame body disposed on the support member so as to surround the light-emitting device, the frame body including part connected to the support member and part not connected to the support member, the part not connected to the support member being left spaced from an upper surface of the substrate. Moreover, the light-emitting apparatus is constituted so that a level of a lower surface of the light-emitting device is higher than a level of a lower surface of the frame body.

Light-emitting apparatus

A package for housing an optical semiconductor element includes a base body having an optical semiconductor element mounting portion on an upper main surface thereof; a frame body joined to the base body so as to surround the mounting portion; and an optical fiber securing member fitted in a through hole which penetrates through the frame body. The frame body is formed by bending a single strip-like plate member at its several positions, and then bonding one end side and an other end side thereof, the through hole being provided so as to be located at a juncture of the one end side and the other end side.

Package for housing optical semiconductor element and optical semiconductor device

To improve the luminance of light emitted by a light-emitting device, the light-emitting device includes a base () that has an opening part () constituted by a light-reflecting surface () and a bottom surface (), a light-emitting chip () that is mounted on the bottom surface () of the opening part (), a transparent member () that covers the light-emitting chip (), and an optical member () that is disposed on the transparent member (). The transparent member () is disposed on the bottom surface () of the opening part () in a state where the transparent member () is spaced away from the light-reflecting surface () of the opening part ().

A light emitting device includes a substrate; a light emitting element disposed on the substrate; and a wavelength conversion member disposed on or above the substrate, the wavelength conversion member covering the light emitting element spacing apart therefrom, and having a level difference at an outer peripheral portion of a lower end of the wavelength conversion member, the lower end being joined to the substrate via a light transmitting member. In addition, the light emitting device includes a light blocking member disposed on the substrate and disposed between the light emitting element and the light transmitting member. Further, the wavelength conversion member is configured so that the lower end thereof extends from a top of the light transmitting member to a side of the light transmitting member.

Light emitting device

A light emitting device includes a light emitting element, a base, and a transparent layer. The base has an upper side portion including a first portion and a second portion. The first portion includes a mounting region of the light emitting element, and has a first porosity. The second portion surrounds the first portion, includes a plurality of transparent particles, and has a second porosity larger than the first porosity. The light transmitting layer encapsulates the light emitting element, and is attached to the first portion in a state where the transparent layer is apart from the second portion.

A light emitting device includes a base on which a wiring conductor is formed from the top surface to the bottom surface or the side face; a light emitting chip mounted on the top surface of the base and electrically connected with the wiring conductor; a first light transmitting member which covers the light emitting chip; a second light transmitting member provided above the first light transmitting member to cover the first light transmitting member, the second light transmitting member being formed of a light transmitting material containing fluorescent materials for converting in wavelength the light emitted from the light emitting chip; and a third light transmitting member provided between the first and second light transmitting members, wherein the refractive index nof the first light transmitting member, the refractive index nof the second light transmitting member and the refractive index nof the third light transmitting member satisfy the relation: n&#x3c;nand n&#x3c;n, thereby achieving higher light extraction efficiency, higher optical intensity of radiation, and higher axial luminosity and brightness.

Light emitting device and illumination apparatus

A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

Package for light-emitting device, light-emitting apparatus, and illuminating apparatus

A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.

Light emitting device and method for manufacturing the same

A light-emitting device has a base, a light-emitting chip and a light emitter. The light-emitting chip is made of semiconductor material, and is mounted on the base. The light-emitting chip generates the primary light. The light emitter includes fluorescent material being excited by the primary light to emit a secondary light. The light emitter has a first surface with uneven surface texture.

Growing community of inventors

Higashiomi, Japan

Daisuke Sakumoto