Taiyo Yuden Co., Ltd.

Daisuke Sakate

Kotaro Mizuno

Minoru Ryu

Sadanori Shimoda

Fumi Taniguchi

A multi-layer ceramic electronic component includes a multi-layer unit and a side margin. The multi-layer unit includes a capacitance forming unit, a cover, and a side surface. The capacitance forming unit includes ceramic layers that are laminated in a first direction and contain boron, and internal electrodes disposed between the ceramic layers. The cover covers the capacitance forming unit in the first direction. The side surface faces in a second direction orthogonal to the first direction. The side margin covers the side surface in the second direction and has a lower boron concentration than a boron concentration of the ceramic layers.

Multi-layer ceramic electronic component and method of producing the same

A multi-layer ceramic capacitor includes a multi-layer unit, a side margin, and a bonding unit. The multi-layer unit includes ceramic layers laminated in a first direction, and internal electrodes disposed between the ceramic layers and mainly containing nickel. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction. The bonding unit is disposed between the multi-layer unit and the side margin and has a higher concentration of magnesium than the ceramic layers and the side margin.

Multi-layer ceramic capacitor and method of producing the same

A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction, and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction, the side margin having a higher concentration of a rare-earth element and a higher concentration of vanadium than center portions of the ceramic layers in the second direction.

In an embodiment, a multilayer ceramic capacitorhas a capacitor body comprising a capacitive partconstituted by multiple internal electrode layersthat are stacked with dielectric layersin between, as well as dielectric cover partsthat respectively cover both sides of the capacitive partin the stacking direction. Also, the dielectric layersof the capacitive part, and the dielectric cover parts, contain elemental manganese, and the elemental manganese is distributed in such a way that its quantity gradually decreases in the depth direction from the exterior faces of the dielectric cover partstoward the center of the dielectric layersof the capacitive part

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Tokyo, Japan

Daisuke Sakate