Tomoegawa Paper Co., Inc.

Daisuke Orino

Takeshi Hashimoto

Masaharu Kobayashi

Takeshi Sato

Thermosetting low-dielectric resin composition and use thereof

The present invention relates to a thermosetting low dielectric resin composition, a laminate for use in printed wiring, a laminate for a circuit, and the like. The present invention's thermosetting low dielectric resin composition contains a specific siloxane denatured polyimide, a compound having two or more allyl or methylallyl groups, and a compound having two or more maleimide groups. This resin composition adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and demonstrates very little scattering of the resin during operational processes like punching or cutting. By using laminates or laminates for circuits that employ this resin composition, electrical signals can be propagated more quickly, enabling signals to be processed at faster speeds. In addition, the present invention can be applied to the formation of miniaturized circuit wiring, and is suitably employed in electronic devices employed in the high frequency region, and, in particular, in electronic devices that must be made smaller and lighter in weight.

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Shizuoka, Japan

Daisuke Orino