Mitsubishi Gas Chemical Company, Inc.

Japan Science and Technology Corporation

Daisuke Ohno

Yasumasa Norisue

Kenji Ishii

Makoto Miyamoto

Kiyonari Hiramatsu

Akikazu Amagai

Makoto Yamazaki

Kenzi Ishii

Katsutoshi Yamazaki

Masayuki Katagiri

Yuuichi Sugano

Michio Nawata

Masanobu Sogame

Seiji Kita

Kazuyoshi Uera

Takashi Yamamoto

Nobuyuki Ikeguchi

Nobuhiro Nishiyama

Kazunori Kataoka

Yoshikazu Shima

Atsushi Hirashima

Takuzo Aida

Yoshinori Kondo

Masayoshi Ueno

Seiji Shika

Mitsuru Nozaki

Yohei Abiko

Shuya Suenaga

Masahiro Shimada

Takeru Horino

Kunitoshi Mimura

Ryuichiro Kawai

Takabumi Omori

Hiroaki Oka

Tomoaki Kubota

Rigoberto C Advincula

Tomohiro Hariu

Hironao Fukuoka

Masamitchi Mizukami

Dong-Lin Jiang

Hendrick Stapert

Takafumi Takada

A composition for an oil or gas well formation, containing a viscoelastic surfactant; and a modified nanomaterial and a producing method of the composition, and a forming method of the oil or gas well. The modified nanomaterial optionally contains a nanocellulose. The modified nanomaterial optionally has, on its surface, a sulfate group, a sulfite group, a carboxy group, an ethylene oxide chain, an amino group, an ester group, a silane group, a tertiary ammonium group or a mixture thereof.

Acid matrix applications: well stimulation and completion fluids using viscoelastic surfactants and modified additives

An asymmetric membrane including a crosslinked polyimide resin, the crosslinked polyimide resin being formed by crosslinking a polyimide resin by a crosslinking agent; the polyimide resin including a structural unit (A) derived from tetracarboxylic dianhydride and a structural unit (B) derived from diamine; the structural unit (A) including a structural unit (A-1) derived from a compound represented by Formula (a-1); the structural unit (B) including a structural unit (B-1) derived from Formula (b-1), and a proportion of the structural unit (B-1) per 100 mol % of the structural unit (B) being from 0.1 to 50 mol %; and the crosslinking agent being a compound having not less than two functional groups that bond with carboxy groups.  In Formula (b-1), Qand Qare each independently a group including an aromatic group, an aliphatic hydrocarbon group, and/or an alicyclic hydrocarbon group; X is a single bond or a particular group.

Asymmetric membrane

To provide a novel cyanate ester compound that can realize a cured product having low dielectric constant and dielectric loss tangent, and excellent flame retardancy and heat resistance, and moreover has relatively low viscosity, excellent solvent solubility, and also excellent handling properties, and a method for producing the cyanate ester compound, and a curable resin composition and the like using the cyanate ester compound. A phenol-modified xylene formaldehyde resin is cyanated.

Cyanate ester compound and method for producing the same, and curable resin composition comprising the compound, and cured product thereof composition

Provided is a cyanate ester polymer having excellent flame retardance, low dielectric constant, low dielectric loss tangent and high heat resistance. Specifically provided is a cyanate ester polymer obtained by polymerizing a cyanate ester compound represented by the following general formula (1). (1) In the formula, X represents OCN or OH, and 10-100% by mol of X is composed of OCN. 

Cyanate ester polymer

A curable resin composition containing a specific vinyl compound obtained by vinylation of a terminal of a bifunctional phenylene ether oligomer having a polyphenylene ether structure in a molecule and a specific bismaleimide compound having at least two maleimide groups in a molecule, a curable film comprising the above composition, a cured product obtained by curing the above composition, and a film obtained by curing the curable film. The above resin composition is excellent in curability even in the presence of oxygen, is curable at a low temperature and is capable of giving a cured product having a low dielectric constant, a low dielectric loss tangent, high heat resistance, excellent mechanical properties, excellent chemical resistance and excellent flame retardancy.

Curable resin composition, curable film and their cured products

A novel polyimide as a high molecular weight material having a low dielectric constant, a low dielectric loss tangent and low water absorptivity, a polyamic acid capable of generating the above polyimide, the above polyimide and the polyamic acid being obtained by reacting an aromatic diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with an acid anhydride, a process for the production of the polyimide, a process for the production of the polyimide, a film of the polyimide, and a laminate comprising the above film.

Polyimide, polyamic acid and processes for the production thereof

A polyfunctional phenylene ether oligomer (B) having 3 to less than 9 phenolic hydroxyl groups, obtained by reacting a polyfunctional phenol (A) having 3 to less than 9 phenolic hydroxyl groups per molecule and having alkyl groups and/or alkylene groups at 2- and 6-positions of at least one of the phenolic hydroxyl groups with a monohydric phenol compound of the formula (1), derivatives thereof, resin compositions containing the derivatives, curable films obtained therefrom and cured films thereof,  wherein Rand Rare the same or different and represent a hydrogen atom, a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group, and Rand Rare the same or different and represent a halogen atom, an alkyl group having 6 or less carbon atoms or a phenyl group.

Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof

The present invention provides a bifunctional phenylene ether oligomer compound having a thermosetting functional group at each terminal, an epoxy resin containing the above oligomer compound and a use thereof. That is, it provides a sealing epoxy resin composition for sealing an electric part, an epoxy resin composition for laminates, a laminate, a printed wiring board, a curable resin composition and a photosensitive resin composition. The resins and resin compositions of the present invention are used in electronics fields in which a low dielectric constant, a low dielectric loss tangent and high toughness are required and also used for various uses such as coating, bonding and molding.

Carboxylic acid-modified bisphenol epoxy di(meth)acrylate

(Meth)acrylated epoxy-terminated polyphenylene ether

A curable resin composition containing as essential components a high molecular weight compound having a weight average molecular weight of at least 10,000 and a vinyl compound of the formula (1). 

Curable resin composition, curable film and cured film

A cyanate ester compound represented by the formula (1), 

Cyanate ester compound, flame-retardant resin composition, and cured product thereof

A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3),HO&#x2014;YO&#x2014;X&#x2014;OY&#x2014;OH &#x2003;&#x2003;(1)HO&#x2014;X&#x2014;OH &#x2003;&#x2003;(2)Y&#x2014;OH &#x2003;&#x2003;(3) and Y&#x2014;O&#x2014; is represented by the formula (3), 

Carboxylic acid-modified biphenyl epoxy diacrylate

(Meth)acrylate-terminated polyphenylene ether

A bifunctional phenylene ether oligomer containing monophenylene and biphenylene moieties can be rendered thermosetting by reacting the terminal phenolic hydroxyl groups with a) a cyanogen halide to introduce terminal cyanate groups, b) a halogenated glycidyl to form terminal epoxy groups, or c) an allyl halide to produce allylic terminal groups. The epoxy-terminated phenylene ether oligomer can be further reacted acrylic and/or methacrylic acid to yield an epoxy di(meth)acrylate which can be further modified with a carboxylic acid or anhydride to obtain and acid-modified epoxy di(meth)acrylate.

Di(meth)acrylate of epoxy-terminated polyphenylene ether

Polyphenylene ether oligomer compound, derivatives thereof and use thereof

Growing community of inventors

Tokyo, Japan

Daisuke Ohno