Panasonic Intellectual Property Management Co., Ltd.

Daisuke Nii

Yoshihiko Nakamura

Hidetsugu Motobe

Toshiyuki Higashida

Mitsuyoshi Nishino

Hiroyuki Fujisawa

Koichi Isaji

Kenichi Toshimitsu

Fuminori Sato

A resin composition contains an epoxy compound and a curing agent. The epoxy compound includes a phosphorus-containing epoxy compound having a phosphorus atom in its molecule. The curing agent includes a phosphorus-containing acid anhydride having a phosphorus atom and an acid anhydride group in its molecule.

Resin composition, prepreg, film with resin, sheet of metal foil with resin, metal-clad laminate, and printed wiring board

A multilayer printed wiring board includes a core substrate, a first buildup layer, and a second buildup layer. The first buildup layer includes a first insulating layer and a first conductor layer alternately laminated with each other. The second buildup layer includes a second insulating layer and a second conductor layer alternately laminated with each other. The core substrate, the first insulating layer, and the second insulating layer each include a glass cloth. The glass cloth is woven with warp threads and weft threads. The warp threads each have a width narrower a width of each of the weft threads. Each of the warp threads constituting the glass cloth in the first insulating layer and the second insulating layer both lying adjacent to the core substrate is arranged perpendicular to each of the warp threads constituting the glass cloth in the core substrate.

Multilayer printed wiring board and method for producing multilayer printed wiring board

A resin composition contains an epoxy resin, and a curing agent including a first acid anhydride and a second acid anhydride. An unsaturated bond concentration in the second acid anhydride is not higher than 0.7%. The unsaturated bond concentration is represented by following formula (1). The ratio of the number of acid anhydride equivalents of the first acid anhydride to the number of epoxy equivalents of the epoxy resin is between 0.05 and 0.5 (inclusive). The ratio of the total number of acid anhydride equivalents of the first acid anhydride and the second acid anhydride to the number of epoxy equivalents is between 0.5 and 1.1 (inclusive).Unsaturated bond concentration={(number of unsaturated bonds per molecule)/(molecular weight)}/(number of acid anhydride groups per molecule)&#xd7;100&#x2003;&#x2003;(1)

Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring board

A resin composition contains a preliminary reaction product obtained through mixing an epoxy resin and a monofunctional acid anhydride as a first curing agent in an equivalence ratio of the epoxy resin to the monofunctional acid anhydride in a range of 1:0.1 to 1:0.6, and reacting the epoxy resin and the monofunctional acid anhydride such that a percentage of ring opening of the monofunctional acid anhydride is 80% or more, and a second curing agent being a different compound from the monofunctional acid anhydride.

Resin composition, prepreg and laminate board

Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.

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Fukushima, Japan

Daisuke Nii