Stanley Electric Co., Ltd

Mitsubishi Electric Corporation

Keio University

National Institutes for Quantum and Radiological Science and Technology

Daisuke Nakashima

Katsuhiko Omae

Norifumi Imazeki

Takanobu Kajihara

Junya Suzuki

Muneaki Mukuda

Shunsuke Fushie

Hiroyuki Miyanishi

Masahiro Motooka

Yuki Nakamatsu

Masaki Kato

Naoya Sone

Yoshinori Shimada

Takuya Oga

Hajime Okada

Shuji Kondo

Kazuyasu Sakamoto

Mari Kawabata

Manabu Yatabe

Toshiyuki Kitamura

Katsuhiro Mikami

Noboru Hasegawa

Masaharu Nishikino

Tsuyoshi Sugihara

Takeo Nagura

Tsuyoshi Jida

Gen Tada

Kouichi Osaka

A light-guide-part has width that gradually increases from first-end toward second-end and shape in which both sides of the light-guide-part in widthwise direction having optical axis interposed between are curved toward one-direction. An incidence-part has incidence-surface located in central part of the first-end of the light-guide-part and facing light source. The incidence-surface has shape in which both sides of the incidence-surface in the widthwise direction having the optical axis interposed between are curved toward the one-direction, curved in concave shape when the light-guide-part is seen from the one-direction, and curved in convex shape in cross section in thickness direction of the light-guide-part parallel to the optical axis. A reflecting-part has reflecting-surface inclined toward the one-direction on the second-end of the light-guide-part. The reflecting-surface has shape in which both sides of the reflecting-surface in the widthwise direction having the optical axis interposed between are curved toward the one-direction.

Lighting tool for vehicle

An implant installation strength evaluation method includes a step of vibrating an implant, a step of measuring time series data of the number of vibrations and vibration strengths of the implant vibrated in the vibrating step, and a step of deriving information indicating an index of an installation strength of the implant based on the time series data of the number of vibrations and vibration strengths of the implant.

Implant installation strength evaluation method, implant installation strength evaluation device, and program

A vehicular lamp fitting, comprising a light guiding plate having a front surface and a back surface, and a light source which emits light guided by the light guiding plate, wherein the front surface includes first light control surfaces, the back surface includes second light control surfaces, and concave portions each of which is disposed between two adjacent second light control surfaces, the first light control surface is a refraction surface which is configured such that the exit angle of the light from the light source in the horizontal direction, which is refracted and exits through the first light control surface, be a predetermined angle, and the second light control surface is a reflection surface which is configured such that the exit angle of the light from the light source in the vertical direction, which exits through the first light control surface, be a predetermined angle.

Vehicular lamp fitting

In a semiconductor device, a thinly-molded portion covering a whole of a heat dissipating surface portion of a lead frame and a die pad space filled portion are integrally molded from a second mold resin, because of which adhesion between the thinly-molded portion and lead frame improves owing to the die pad space filled portion adhering to a side surface of the lead frame. Also, as the thinly-molded portion is partially thicker owing to the die pad space filled portion, strength of the thinly-molded portion increases, and a deficiency or cracking is unlikely to occur.

Semiconductor device

In a semiconductor device, a first skirt portion molded from a first mold resin and a second skirt portion molded from a second mold resin are provided on a heat dissipating surface of a lead frame. Also, a thinly-molded portion is molded integrally with the second skirt portion from the second mold resin. According to this kind of configuration, adhesion between the thinly-molded portion and lead frame is high, and the semiconductor device with excellent heat dissipation and insulation is obtained.

An illumination device can include a light source; and a light guiding lens for receiving light from the light source. The light guiding lens includes a light emission portion that extends in a predetermined direction and has a main surface with reflecting cuts, and a light guiding portion provided to the light emission portion at an end portion thereof in the predetermined direction. The light guiding portion is configured to project more than the light emission portion in a thickness direction of the light emission portion and extend along the end portion of the light emission portion. The light source is disposed to face to an end face of the light guiding portion in an extending direction of the light guiding portion, the end face projecting more than the light emission portion. An end face of the light guiding portion has reflecting cuts arranged in the extending direction.

Illumination device

A vehicle lighting fixture can achieve uniform projection of light while being capable of providing improved luxurious sense of projected light. The vehicle lighting fixture can include a housing, an outer lens configured to cover an opening of the housing to define a lighting chamber; and a light source and a light guiding lens located in the lighting chamber. The light guiding lens is configured so as to receive light from the light source and guide the light to a light exiting surface thereof for light projection. The light guiding lens has a functional surface which is opposite to the light exiting surface and can include a plurality of flute cuts configured to diffuse light and a plurality of prism cuts configured to reflect light. The plurality of prism cuts are arranged at random on the functional surface.

Vehicle lighting fixture

A vehicle lighting unit can distribute light in a wider area than the conventional lighting unit without increasing the number of parts. The vehicle lighting unit can include: a light source; a light guiding member configured to have a side portion to receive light from the light source from the side portion and guide the light, and have an inclined face formed obliquely rearward in a light guiding path of the light; and a reflection face inclined forward and disposed to face to the inclined face with a gap between the reflection face and the inclined face of the light guiding member.

Vehicle lighting unit

A scale-like portion wherein metal plating is changed into a scale-like form is provided by continuously carrying out laser spot irradiation on a lead frame, the front surface of which is coated with the metal plating. The scale-like portion is disposed in an optional portion of the lead frame, for example, in the vicinity of a gate break mark, in an outer peripheral portion in a region sealed with a molding resin, or around a semiconductor element. The adhesion between the lead frame and the molding resin improves owing to the anchor effect of the scale-like portion, and it is thus possible to suppress the molding resin separating from the lead frame.

A semiconductor device is provided, in which a first lead () is joined with the bottom electrode () of a MOS-FET () with first solder (), the top electrode () of the MOS-FET is joined with an internal lead () with second solder (), the internal lead is joined with a projection () of a second lead with third solder (), and the first lead, second lead, MOS-FET and internal lead are integrally molded using sealing resin (), wherein the first solder and second solder include support members () and (), respectively, located thereinside and positions of the internal lead and MOS-FET are stabilized by self-alignment.

Growing community of inventors

Tokyo, Japan

Daisuke Nakashima