Panasonic Intellectual Property Management Co., Ltd.

Fujitsu Corporation

Panasonic Corporation

Daisuke Nagai

Katsuhiko Itoh

Mitsuo Nakamura

Kenji Okamoto

Shigeru Suzuyama

Hiroshi Kinoshita

Hiroki Hamachi

Kunihiko Hamamoto

Takahiro Suetsugu

Shingo Suzumori

An electronic component mounting system includes: a printing apparatus; an electronic component mounting apparatus; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic components. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for the respective electronic components by referring to the mounting information.

Electronic component mounting system and electronic component mounting method

In mounting position correction of detecting a position of printed solder, calculating a positional-shift amount between a position of an electrode and the position of the printed solder, and correcting a mounting position based on the calculated positional-shift amount, when a correction amount based on the calculated positional-shift amount exceeds a limit value which indicates an upper limit of the correction amount which is defined and allowed in mounting information, the electronic component is mounted on the mounting position which is corrected by considering the limit value as the correction amount. Accordingly, it is possible to appropriately employ mounting position correction by considering a solder printing position as a reference in accordance with the degree of printing position shift, and to obtain an expected joint quality improvement effect.

An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component.

A substrate standby unit that is capable of keeping only one substrateon standby in a substrate sorting mechanismthat moves the substratefrom the print inspection device Mto the component installation device M, a memory devicethat stores a substrate ID on the substratethat is on standby in the substrate standby unit, and a substrate ID management unitthat updates the substrate ID that is stored in the memory deviceaccompanying the transfer of the substratefrom the print inspection device Mto the substrate standby unit are included. The substrate ID stored in the memory deviceand the inspection result data associated with this substrate ID and stored in an inspection result data memory unitare transmitted to the component installation device M

Electronic component mounting system

The disclosed apparatus includes a MAC learning table storing a MAC address and port identification information that uniquely identifies a port for transferring a frame to which the MAC address is assigned. The apparatus includes updating the MAC learning table, reading a MAC address of a link trace frame, transferring the link trace frame via a port determined based on the MAC learning table, storing a correspondence relationship of a predetermined MAC address and port identification information, saving a correspondence relationship set as an object to be deleted at a time of updating the MAC learning table, transferring the link trace frame, if there is no correspondence relationship relevant to the MAC address of the link trace frame in the MAC learning table, and sending a response frame to a switching hub which is an originator of the link trace frame with transfer of the link trace frame.

Link trace frame transfer program recording medium, switching hub, and link trace frame transfer method

The electronic component mounting line includes a computing unit for calculating a print position of solder paste printed on board-side electrodes, an electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, a placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, a bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and a mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled.

Component-mounted board production apparatus and position control method for electronic components in component-mounted board production apparatus

A frame transmission device having a port for transmitting and receiving a frame and a learning table for storing a transmission source address included in the frame received at the port and the receiving port in association with each other includes: a port detector for detecting whether learning data coincident with the transmission source address included in the frame received at the port is stored in the learning table; a port judging unit for comparing a port learned in the learning data detected by the port detector to the receiving port; and a loop judging unit for judging on the basis of a time lapse from the storage of the learning data whether the frame is in a loop or not when the port learned in the learning data is not coincident with the receiving port.

Growing community of inventors

Yamanashi, Japan

Daisuke Nagai