Mitsubishi Electric Corporation

Seikagaku Corporation

Mitsubishi Heavy Industries Limited

Mitsubishi Power, Ltd.

Daisuke Morita

Nobuo Kobayashi

Kazutaka Ikeda

Tomohiro Kyoto

Motoaki Tamaya

Tsuneo Koji

Hisatomo Kunii

Yumi Genda

Mizuho Ishikawa

Hiroyuki Takeuchi

Naoki Nakamura

Shinji Kimura

Kazuhiro Maeda

Hiroyuki Kawahara

Masafumi Minami

Kimio Shigihara

Chihiro Myoren

Koji Kise

Tomotaka Katsura

Hiroaki Tatsumi

Ryosuke Mito

Keisuke Furuta

A heat sink having a coolant flow path formed inside through which a coolant flows includes: a heat transfer plate having a first surface on which a semiconductor device is disposed and a second surface; a junction flow path-forming plate having a third surface and a fourth surface; a first partition wall provided in contact with the second surface and the third surface; and first fins provided in contact with the second surface. The coolant flow path includes a first flow path. A plurality of first divided regions separated by the at least one first partition wall are formed in the first flow path. The plurality of first fins are arranged by being spaced side by side in the first divided regions.

Heat sink and semiconductor module

A compressor includes a rotor including a plurality of disks, a shaft portion connected on a downstream side of the disks; and rotor blade rows fixed to the plurality of disks; a stator including a compressor casing; and a plurality of stator vane rows each provided between corresponding adjacent ones of the rotor blade rows; an outlet guide vane including blade main bodies disposed at an interval in a circumferential direction on the downstream side of the disk located most downstream, and inner shrouds connecting the blade main bodies in the circumferential direction, on an inner side in a radial direction; and an inner casing disposed on the downstream side of the disk located most downstream with a gap between the disk and the inner casing. The inner casing includes an outer peripheral wall surface having recesses accommodating the inner shrouds and forming, together with an inside surface of the compressor casing, a diffuser on the downstream side of the recesses, and an inner peripheral wall surface forming an air extraction cavity. An air extraction hole is formed in a portion, in the recesses, on the downstream side.

Compressor and gas turbine

A semiconductor laser machine includes a semiconductor laser element including a first end face that emits a laser beam and a second end face that is opposite the first end face; a heat sink; and a sub-mount securing the semiconductor laser element to the heat sink. The sub-mount includes a substrate that serves as a thermal stress reliever, a solder layer joined to the semiconductor laser element, and a junction layer formed between the substrate and the solder layer. Compared with the semiconductor laser element, the substrate is extended in a rearward direction that is from the first end face toward the second end face. As for the solder layer and the junction layer, a portion of at least the solder layer is removed behind the second end face.

Semiconductor laser machine

A laser device includes: a plurality of laser diodes that emit laser beams having different wavelengths; a partial reflection mirror that resonates the plurality of laser beams emitted by the plurality of laser diodes; and a wavelength dispersion element that causes the plurality of laser beams incident from the plurality of laser diodes in different orientations of optical axes of the laser beams to travel to the mirror with the optical axes aligned. Each of the plurality of laser diodes is integrally formed with an adjustment component that is rotatable around an emission end of the laser diode.

Laser device and laser processing machine

A multistage axial compressor includes: a rotational shaft to which a plurality of rotor blades are mounted; a casing surrounding the rotational shaft, the casing forming a flow passage of a working fluid between the rotational shaft and the casing; a wall portion having an annular shape and extending in a circumferential direction of the rotational shaft so as to surround the casing, the wall portion forming an bleed chamber having an annular shape and being in communication with the flow passage; a plurality of port portions connected to an outer peripheral surface of the wall portion, the port portions forming respective outlet flow passages which are in communication with the bleed chamber; and a plurality of bleed pipes connected to the respective port portions.

Multistage axial compressor and gas turbine

A laser device includes a plurality of laser diodes that generate laser light beams having different wavelengths from each other, a partial reflective mirror constituting a resonator along with the laser diodes, a wavelength dispersive element set in the resonator, which combines parts of the laser light beams outputted by the laser diodes to each other, emits the combined parts of the laser light beams as a first laser light beam toward the partial reflective mirror, and emits other parts of the laser light beams as second laser light beams in directions different from the direction toward the partial reflective mirror, and an output detecting unit detecting intensities of the second laser light beams.

Laser device

The purpose of the present invention is to provide a laser light source module that is capable of heat dissipation from a laser device and of suppressing the diffusion of a light beam due to the close arrangement of the laser device. The laser light source module comprises a stem that is a base plate and first and second laser assemblies disposed on the stem. Each of the laser assemblies comprises a multi-emitter LD bar that is a laser device emitting a laser light along an optical axis, and a holding member having a mounting surface parallel to the axis, the multi-emitter LD bar being mounted on the mounting surface. The first and second laser assemblies are positioned such that the optical axes of the assemblies are parallel to each other and that the mounting surfaces of the assemblies are arranged opposite to each other in parallel.

Laser light source module

Provided is a laser light source device which has a plurality of semiconductor laser elements arranged in an array and is provided with: a heat sink; a sub-mount substrate which is placed on one end edge of the heat sink, which has a power feed path, and on which the semiconductor laser array is mounted; an insulation plate placed in an area other than the sub-mount substrate on the heat sink; a first electrode plate mounted on the insulation plate; a second electrode plate mounted on the insulation plate separately from the first electrode plate; metal wires electrically connecting respectively between the first electrode plate and the sub-mount substrate and between the second electrode plate and the semiconductor laser array; and a cooling block on which the heat sink is mounted and which has a cooling water flow channel inside of the cooling block.

Laser light source device

A laser diode includes a ridge portion, channel portions located adjacent to the ridge portion such that the ridge portion is sandwiched, the channel portions being shorter in height than the ridge portion, terrace portions adjacent to opposite sides of the respective channel portions from the ridge portion and longer in height than the channel portions, supporting portions provided over the respective channel portions, separated from side surfaces of the ridge portion or side surfaces of terrace portions or both, and made of resin, a ceiling portion including first portions provided over the supporting portions and second portions continuous with the first portions and located over the respective channel portions with hollow portions interposed therebetween, the ceiling portion being made of resin, and a metal layer provided over the ceiling portion and connected to an upper surface of the ridge portion.

Laser diode and method of manufacturing laser diode

A semiconductor laser device includes a substrate, a buffer layer provided on an upper surface of the substrate and formed of InP, a laser element having a ridge structure formed above the buffer layer, and an epi intermediate layer formed of a compound semiconductor containing As and exposed to the outside.

Semiconductor laser device and method of manufacturing the semiconductor laser device

A semiconductor device manufacturing system includes: a PL evaluation apparatus that evaluates wavelengths of photoluminescent light produced by individual optical modulators on a single semiconductor wafer; an electron beam drawing apparatus that draws patterns of diffraction gratings of laser sections that adjoin respective optical modulators on the wafer; and a calculation section that receives the wavelengths of the photoluminescent light from the PL evaluation apparatus, calculates densities of respective diffraction gratings so that differences between the wavelengths of the photoluminescent light and oscillating wavelengths of the laser sections become a constant, and sends the densities calculated to the electron beam drawing apparatus for drawing respective diffraction grating patterns on the respective laser sections.

System for manufacturing semiconductor device

The purpose of the present invention is to provide a pharmaceutical composition that is useful for the treatment of diseases that are caused by an increase in bone resorption and that does not cause serious side effects even when used in combination with another drug. The present invention relates to: an &#x3b1;-oxoacyl amino-caprolactam derivative that is represented by formula (I) (in the formula, X is &#x2014;O&#x2014; or &#x2014;N(R)&#x2014; and Rrepresents an alkoxycarbonyl group having 1-10 carbon atoms); and a bone resorption inhibitor containing the &#x3b1;-oxoacyl amino-caprolactam derivative.

Alpha-oxoacyl amino-caprolactam derivative

The purpose of the present invention is to provide a pharmaceutical composition that is useful for the treatment of diseases that are caused by an increase in bone resorption and that does not cause serious side effects even when used in combination with another drug. The present invention relates to: an &#x3b1;-oxoacyl amino-caprolactam that is represented by formula (I) (in formula (I), X represents N or CH, Y represents O or CH, and Z represents S or CH); and a bone resorption inhibitor containing the &#x3b1;-oxoacyl amino-caprolactam.

Growing community of inventors

Tokyo, Japan

Daisuke Morita