Keio University

Daisuke Mizoguchi

Tadahiro Kuroda

Noriyuki Miura

Takayasu Sakurai

Yusmeeraz Binti Yusof

Noriyuki Mirua

The present invention has an object to provide an electronic circuit testing apparatus that is preferable for testing an electronic circuit which carries out communications between substrates based on inductive coupling and is capable of testing the electronic circuit without using test pads, wherein a probeis caused to intervene in a communications channel composed by inductive coupling based on the first and second transmitter coils; and the first and second receiver coils, and an LSI is tested by a tester, buffersand, and a Tx/Rx switch. Accordingly, it is not be necessary for that the electronic circuit testing apparatus is provided with a needle that touches pads and leads of the electronic circuit, and the service life there can be lengthened.

Electronic circuit testing apparatus

An electronic circuit capable of reducing crosstalk to such a degree that the crosstalk can be substantially disregarded even where a plurality of communications channels are juxtaposed in close proximity to each other when achieving communications between substrates by inductive coupling. The transmitter coilsare placed on a lower chip and the receiver coilsare placed on an upper chip, and where it is assumed that the distance between the chips is X, and the distance between the communications channels is Y (that is, the horizontal distance between the coil centers), there exists a position, where the magnetic flux density in the receiver coilsresulting from the transmitter coilsbecomes zero (0), at a predetermined Yo. That is, because large crosstalk occurs when Y is small, and small crosstalk of an inverted symbol occurs when Y is large, in the meantime, there will exist a position, where the value obtained by integrating the magnetic flux density B in the receiver coilsbecomes zero (0), without fail. No crosstalk is theoretically generated at the position.

Electronic circuit

An electronic circuit capable of efficiently transmitting signals in a case where signals are transmitted over substrates with three or more substrates three-dimensionally mounted. In the present invention, LSI chips are stacked in three layers, and a bus is formed over three chips. The first through the third transmitter coils 13, 13, 13and the first through the third receiver coils 15, 15, 15are formed by wiring on the first through the third LSI chips 11, 11, 11. These three pairs of transmitter and receiver coils are disposed so that the centers of the openings thereof are coincident with each other, whereby three pairs of transmitter and receiver coils 13 and 15 form inductive coupling to enable communications. The first through the third transmitter circuits 12, 12, 12are connected to the first through the third transmitter coils 13, 13and 13, respectively, and the first through the third receiver circuits 14, 14, 14are connected to the first through the third receiver coils 15, 15, 15, respectively.

An electronic circuit capable of carrying out communications by inductive coupling with minimum power consumption between substrates. Although the amplification factor of the amplifieris 1, the amplification factors of the amplifiersthroughare, respectively, 2, 4 and 8. Amplification is carried out at the amplification factorsthrough(=1+2+4+8) as a whole by a combination thereof. The transmit power control registeroutputs ON and OFF signals to the respective amplifiersthroughso as to bring about transmit power responsive to the distance to a substrate having a receiver coil which is a destination of transmission (that is, the distance between a transmitter coil and a receiver coil), in further detail, so as to have an amplification factor by which transmit power proportionate to the distance can be obtained, and selects a combination of the amplifiersthrough

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Yokohama, Japan

Daisuke Mizoguchi