Omron Corporation

Daisuke Mitsumoto

Yoshinobu Asokawa

Yasumoto Mori

Yasuhiro Ohnishi

Masaki Suwa

Shree Kumar Nayar

Takeshi Kojima

Hiroyoshi Koitabashi

Yuki Honma

Takashi Sakai

Tuo Zhuang

Masanao Yoshino

Sunao Takemura

Yoshiro Murata

To Sho

Yoshiro Ito

A three-dimensional shape measuring apparatus measures by analyzing an optical pattern projected to the measurement target, and luminance of the optical pattern. The apparatus includes a mounting stage having a reference plane of a height of the measurement target, a measurement head that projects the optical pattern, to the measurement target and reference plane, to capture images of the optical patterns, and a displacement portion displaces the measurement head in a height direction. A phase computing portion computes a phase of the optical pattern in a certain pixel included in the captured image. A height computing portion computes a height of the measurement target based on the phase, and a feed amount computing portion computes a displacement amount based on the height. The height computing portion computes the height based on the phase and corrects the height based on the displacement amount, thereby computing the height of the measurement target.

Three-dimensional shape measuring apparatus, three-dimensional shape measuring method, and three-dimensional shape measuring program

A surface state inspection apparatus has a lighting device that irradiates an inspection target placed on a stage with light, an imaging device that images the inspection target, and a detection device that detects a surface defect of the inspection target by analyzing a first inspection image obtained by the imaging device. The lighting device is a surface light source that includes a light emission region having a predetermined size and, in the lighting device, portions of light emitted from positions in the light emission region differ from each other in a spectral distribution. The detection device detects a portion in which a hue is different from that of its surrounding portion in the inspection target surface as a flaw. The detection device detects a portion in which the hue is substantially equal to that of its surrounding portion while brightness is different from that of its surrounding portion as a stain.

Apparatus and method for inspecting surface state

The shape measurement apparatus calculates a characteristic amount for a plurality of points of interest on a surface of a measurement target object, based on an image obtained by image capturing with a camera, calculates an orientation of a normal line based on a value of the characteristic amount by referencing data stored in advance in a storage device, and restores the three-dimensional shape of the surface of the measurement target object based on a result of the calculation. The storage device stores a plurality of data sets generated respectively for a plurality of reference positions arranged in a field of view of the camera, and the data set to be referenced is switched depending on a position of a point of interest.

Shape measurement apparatus and calibration method

A shape measuring apparatus that measures a three-dimensional shape of a measuring target has a lighting device that irradiates the measuring target placed on a stage with light, an imaging device that takes an image of the measuring target, a shape calculating device that calculates orientations of normals at a plurality of points on a surface of the measuring target from an image, the image being obtained by performing imaging with the imaging device while the lighting device irradiates the measuring target with the light, the shape calculating device calculating the three-dimensional shape of the surface of the measuring target from the calculation result of the orientations of the normals, a ranging device that measures a distance from a predetermined reference position with respect to at least one point on the surface of the measuring target, and a determination device that determines a spatial position of the three-dimensional shape of the surface of the measuring target, the three-dimensional shape being obtained by the shape calculating device using information on the distance obtained by the ranging device.

Shape measuring apparatus and shape measuring method

An apparatus for measuring a three-dimensional shape of a target object by analyzing an optical pattern projected onto the target object has an optical pattern projecting device that projects the optical pattern onto a portion of a measurement surface on which the target object is placed, the optical pattern having brightness changing periodically according to a position, a first line sensor that images an optical pattern-emitted region onto which the optical pattern is projected, a second line sensor that images an optical pattern-non-emitted region onto which the optical pattern is not projected, and a processing device that calculates a phase of the optical pattern at a pixel included in an image obtained by removing background information from images taken by the first and second line sensors based on a brightness value of the pixel and a neighboring pixel in the image, and calculates height information based on the calculated phase.

Three-dimensional shape measuring apparatus, three-dimensional shape measuring method, three-dimensional shape measuring program, and recording medium

A pattern generating apparatus includes a sequence generating unit and an image data generating unit. The sequence generating unit generates a sequence formed by terms having M-value numeric values. The image data generating unit generates the image data by converting each numeric value of the sequence into a gray-level value according to each numeric value, and the sequence is generated by the sequence generating unit. The sequence generating unit generates the sequence such that vectors expressed by sub-sequences have different directions for the sub-sequence constituting the generated sequence.

Method and apparatus for generating projecting pattern

It is intended to provide an image processing apparatus enabling an image processing for association of a standard image to a reference image using a reduced number of pixels without deteriorating accuracy for detecting a movement of a detection subject. A detection subject region setting unit obtains a picked-up image at a first time point as a standard image from time-series picked-up image data obtained by an image pickup unit and selects a plurality of correlation windows including an image region of the detection subject in the standard image with relative positions with respect to the standard point being identified. A movement detection unit obtains a picked-up image at a second time point that is different from the first time point as a reference image and detects a movement of the detection subject between the standard image and the reference image by calculating in the reference image a position of the standard point that minimizes a difference between a state of pixel values of the correlation windows of the standard image and a state of pixel values of correlation windows of the reference image.

Image processing apparatus, image processing method, image processing program, recording medium recording the image processing program, and moving object detection system

An apparatus, method, and program for measuring the three-dimensional shape of an object by analyzing an optical pattern projected onto the object includes a line sensor and an image analysis unit. The line sensor reads the target object, onto which the optical pattern is projected. The image analysis unit analyzes the optical pattern in the image read by the line sensor based on a spatial fringe analysis method, and the image analysis unit computes the three-dimensional shape information on the target object. The phase of a pixel included in an image taken of the optical pattern is determined based on the brightness values of the pixel and at least one neighboring pixel in the image; thus the height information of the object can be determined. In addition, the height of the target object at a given position can be computed based on how much the phase of the optical pattern projected onto a certain position of the object is shifted from a reference phase.

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Nagaokakyo, Japan

Daisuke Mitsumoto