Ibiden Company Limited

Daisuke Minoura

Takema Adachi

Kiyotaka Tsukada

Yasuhiro Ishii

Toshihiro Nomura

Takashi Yamakawa

A wiring substrate includes a first conductor layer, an insulating layer on the first layer such that the insulating layer is covering the first layer, a second conductor layer on the insulating layer such that the insulating layer is formed between the first and second layers, the connection conductors penetrating through the insulating layer and connecting the first and second layers, and a coating film formed at least partially on surface of the first layer such that the film improves adhesion between the first layer and insulating layer. The first layer includes pads and wiring patterns such that the pads are in contact with the connection conductors and that the patterns have surfaces facing the insulating layer and covered by the film, and the pads have roughened surfaces facing the insulating layer and having first surface roughness that is higher than second surface roughness of the surfaces of the patterns.

Wiring substrate and method for manufacturing wiring substrate

A wiring substrate includes a first conductor layer, an insulating layer formed on the first conductor layer, a second conductor layer formed on the insulating layer, a connection conductor penetrating through the insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer and adhering the first conductor layer and the insulating layer. The first conductor layer includes a conductor pad in contact with the connection conductor such that the conductor pad has a surface having a first region and a second region on second conductor layer side and that surface roughness of the first region is different from surface roughness of the second region, and the conductor pad of the first conductor layer is formed such that the first region is covered by the coating film and that the second region is covered by the connection conductor.

A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor penetrating through the second insulating layer and connecting the first and second conductor layers, and a coating film formed on a surface of the first conductor layer such that the coating film is adhering the first conductor layer and the second insulating layer. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is in contact with the connection conductor and the wiring pattern is covered by the coating film, the conductor pad of the first conductor layer has a surface facing the second insulating layer and having a first surface roughness higher than a surface roughness of a surface of the wiring pattern, and the coating film has opening such that the opening is exposing the conductor pad entirely.

A wiring substrate includes a first insulating layer, a first conductor layer, a second insulating layer, a second conductor layer, a connection conductor, and a coating film. The first conductor layer includes a conductor pad and a wiring pattern such that the conductor pad is formed in contact with the connection conductor and that the wiring pattern is covered by the coating film, the conductor pad has a surface facing the second insulating layer and having first surface roughness higher than surface roughness of a surface of the wiring pattern, and the coating film has opening exposing a portion of the surface of the conductor pad from the coating film and having area larger than area of interface between the conductor pad and the connection conductor and that the connection conductor is formed on the portion of the surface of the conductor pad and is separated from the coating film.

A filter state detection device includes a first pressure detection part, a second pressure detection part, and a filter state determination part. The filter state determination part is configured to include an operation part and a storage part. The operation part is configured to apply Fourier transformation to each of values of first and second pressures to obtain first and second spectral intensities and/or phases at a zero frequency and first and second spectral intensities and/or phases at a predetermined frequency and configured to compare the first spectral intensity and/or phase at a zero frequency and the first spectral intensity and/or phase at the predetermined frequency as a first group against the second spectral intensity and/or phase at a zero frequency and the second spectral intensity and/or phase at the predetermined frequency as a second group to determine a state of a filter.

Particulate collection filter state detection device

A semiconductor device includes wiring boards each having an insulating board, conductor circuits and through-holes, the insulating board having top and bottom surfaces, the conductor circuits formed on the top and bottom surfaces, the through holes penetrating the insulating board and electrically connecting the conductor circuits of the top and bottom surfaces; conductor posts each having flange, head and leg portions, the flange portion having first and second surfaces and having an external diameter larger than that of the through-hole, the head portion protruding from the first surface, the leg portion protruding from the second surface; and electronic components each having an electrode formed on one or more surfaces and connected to the leg portion. The head portion is inserted until the first surface of the flange portion comes into contact with the bottom surface of the wiring board and electrically connected at an inner wall of the through-hole.

Growing community of inventors

Ibi-gun, Japan

Daisuke Minoura