Dai Nippon Printing Co., Ltd.

Mitsubishi Heavy Industries Limited

Japan Aerospace Exploration Agency

Tokyo Institute of Technology

Mitsubishi Electric Corporation

Fanuc Corporation

Nichia Corporation

Hamamatsu-photonics K.k.

Daisuke Matsuura

Daisuke Kobayashi

Yoshikatsu Kuroda

Seiji Take

Hideshi Hattori

Kazuyuki Hirose

Kei Gemba

Osamu Kawasaki

Koichi Suzuki

Koji Eto

Satoshi Narita

Shin Watanabe

Tadayuki Takahashi

Kazutoshi Awano

Yukio Takeda

Takanori Narita

Shin'ichiro Takeda

Yusuke Sugahara

Shigeru Suzuki

Masahiro Kato

Masaaki Katsumata

Kazuhisa Yamamura

Hikaru Yamashiro

Hiroo Yamamoto

Takahiro Ishii

Kenichiro Abe

Takeshi Matsumoto

Daisuke Nakazawa

Tomohiro Ikeda

Shigeru Ishii

Hiroshi Ikebuchi

Masayuki Kakio

Naoto Yamanaka

Yunfeng Wu

Takayuki Komai

Satoshi Shibasaki

Kazumasa Kosugi

Masumi Ohno

Yoshiharu Mori

Masaki Kusano

Yuya Kakehashi

Taichi Ito

There is provided a conveying device that can support a car weight with a mechanism lighter in weight. A driving device () of a conveying device that lifts and lowers a loading-weight support along a rail () includes a wheel unit () and a link (). The wheel unit () drives to rotate a driving wheel () in contact with a guide surface () to lift and lower the loading-weight support. The link () includes a first joint () connected to the wheel unit () and a second joint () rotatably supported by the loading-weight support. The second joint () is arranged in a position further apart from the guide surface () than the first joint (), and above the first joint (). The link () is arranged such that a straight line connecting the first joint () and the second joint () is tilted smaller than 45 degrees.

Conveying device

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.

Wiring board and method for manufacturing wiring board

A wiring board () includes a substrate () that is transparent and a wiring pattern region () that is disposed on the substrate () and that includes a plurality of wiring lines (). The wiring pattern region () has a sheet resistance of less than or equal to 5 Ω/sq, and each wiring line () has a maximum width of less than or equal to 3 μm when viewed at a viewing angle of 120°.

The purpose of the invention is to compensate for the radiation tolerance of a semiconductor memory. An apparatus () for compensating for radiation tolerance comprises: a voltage value acquisition unit () that acquires a data retention voltage value that is a maximum voltage value at which data is inverted when a power supply voltage of a semiconductor memory having a latch circuit is lowered; a correction value determination unit () that determines a voltage correction value on the basis of a difference between the data retention voltage value and a reference voltage value; and a voltage adjustment unit () that adjusts at least one among the power supply voltage and a substrate bias voltage by using the voltage correction value. The reference voltage value is set to be equal to or lower than the data retention voltage value that satisfies a required radiation tolerance.

Apparatus for compensating for radiation resistance of semiconductor memory, method therefor, and electronic circuit

A semiconductor device includes first to N-th PLL circuits configured to operate in synchronization with a common reference clock signal to output first to N-th clock signals, respectively; a majority circuit that performs a majority operation on the first to N-th clock signals to generate a majority clock signal; and a filter circuit to which the majority clock signal is provided, the filter circuit operating as a low-pass filter to output an output clock signal. N is an odd number of three or more.

Semiconductor devices

An operation adjustment method of an SOI device comprises steps of: (a) obtaining a drain current-substrate bias voltage characteristic of an NMOS transistor for a source-gate voltage of 0V; (b) obtaining a lowest substrate bias voltage which turns on the NMOS transistor from the drain current-substrate bias voltage characteristic; (c) determining an upper limit of a substrate bias voltage of a PMOS transistor as a voltage obtained by subtracting a built-in potential of a pn junction from the lowest substrate bias voltage; and (d) determining the substrate bias voltage of the PMOS transistor as a positive voltage lower than the upper limit. Reduction in the power consumption and maintenance of the radiation tolerance are both achieved for the SOI device.

Semiconductor device

A device and method for easily detecting an abnormality of a joint part of a delta-type parallel link robot having a link ball structure, by estimating a friction torque of a ball joint of the robot. A controller of the robot has: a control section configured to control the motion of the robot; a torque measurement section configured to measure or calculate, during the robot is operated, an amount of change in a drive torque, based on a current value of the motor, before and after the robot represents a specified posture where a sign of a relative angular velocity between a ball and a housing of the ball joint is changed; and a judgment section configured to judge that, when the measured amount of change in the drive torque exceeds a predetermined threshold, a friction state of the ball joint corresponding to the motor is abnormal.

Device and method for detecting abnormality of joint of parallel link robot

A substrate for a light emitting element including a resin substrate exhibiting flexibility and a metal wiring portion being formed on at least one surface side of the resin substrate via an adhesive layer, in which a reflective layer composed of a thermosetting resin is disposed between the resin substrate and the adhesive layer, in which the reflective layer contains a light reflective filler at 10% by mass or more and 85% by mass or less and has a reflectance to light at a wavelength of 450 nm of 80% or more.

Substrate for light emitting element and module

A detector for a Compton camera includes a first radiation scattering layer; a second radiation scattering layer; and a radiation absorption layer disposed between the first radiation scattering layer and the second radiation scattering layer. The first radiation scattering layer and the radiation absorption layer configure at least a part of a first detector, and the second radiation scattering layer and the radiation absorption layer configure at least a part of a second detector.

Detector for Compton camera and Compton camera

A radiation measuring apparatus () includes a scatterer detector (A), an absorber detector (B) and a processing unit (). Pixel electrodes () of the scatterer detector (A) and the absorber detector (B) are arranged such that a distance between centers of two neighbor pixel electrodes () is smaller than a mean free path of a recoil electron generated in the Compton scattering of an electromagnetic radiation. The processing unit () specifies and incidence direction of the electromagnetic radiation based on a recoiling direction to which the recoil electron recoils. In this way, an electron tracking-type Compton camera is realized which confines the incidence direction of the electromagnetic radiation by using the recoiling direction of the recoil electron in a Compton camera using a semiconductor detector.

Radiation measuring apparatus and radiation measuring method

A semiconductor integrated circuit, a radiation detection unit and a cooling unit are provided. Here, a radiation detection unit is provided near the semiconductor integrated circuit and detects a radiation quantity. The cooling unit cools the semiconductor integrated circuit according to the detected radiation quantity. In an environment where a radiation quantity is more, the generation of a malfunction can be restrained by cooling the semiconductor integrated circuit.

Electronic device

Fine particles whose excitation light is not UV light or the like which has negative effects on a subject to be analyzed. The excitation light is emitted stably, and has excellent light emitting efficiency. Also a fluorescent probe including: fine particles containing a rare earth element excited by light having a wavelength in a range of 500 nm to 2000 nm and thereby emit up-conversion emission; and a specific binding substance which binds to the fine particles containing a rare earth element.

Fine particles containing rare earth element and fluorescent probe using the same

The present invention provides a security element which is low in cost, is difficult to forge or alter, and can be applied to objects where a high level of security is required. The security element comprises at least a substrate and a fluorescent colorant layer provided on the substrate, wherein the fluorescent colorant layer comprises N species of fluorescent colorants F, wherein N is an integer of 2 or more and n is an integer of not less than one and not more than N, in the same layer, and the fluorescent colorant Fabsorbs light with a wavelength of &#x3bb;and emits fluorescence with a wavelength of &#x3bb;.

Security element, thermal transfer sheet, intermediate transfer recording medium, and method for formation of security element

The invention provides a carrier device for a thermal transfer medium comprising a spool for winding and supporting a thermal transfer sheet or a thermal transfer receiving sheet, wherein a mark containing a coloring material which absorbs an electromagnetic wave of a predetermined wavelength &#x3bb;and emitting an electromagnetic wave of a wavelength &#x3bb;different from the wavelength &#x3bb;is provided on a region in a surface of the carrier device capable of being irradiated with an electromagnetic wave. The invention provides a discrimination method and a printer each of which utilizes such a carrier device capable of executing at least one process among the kind identification, the fake goods determination and the use amount calculation for the thermal transfer sheet or the thermal transfer receiving sheet based on a detection of the mark.

Carrier device for thermal transfer medium, discrimination method using the same, and printer

Growing community of inventors

Tokyo, Japan

Daisuke Matsuura