Sony Corporation

Sony Chemical & Information Device Corporation

Dexerials Corporation

Sony Corporation & Information Device Corporation

Daisuke Masuko

Masahiko Ito

Katsuhiko Komuro

Tadasu Kawashima

Takayuki Matsushima

The invention provides a resin composition capable of achieving excellent chromaticity and a sufficient degree of cure, an adhesive tape, and a method for producing an adhesive tape. The adhesive tape has at least one layer formed by making a resin composition undergo a polymerization reaction, the adhesive composition including: an acrylic monomer; a photopolymerization initiator; and a coloring agent which has a mean volume particle diameter of not less than 1 &#x3bc;m and not more than 20 &#x3bc;m and in which a pigment is encapsulated in a resin, in which the coloring agent is contained so that the pigment content is not less than 0.25 wt % and not more than 1.0 wt %. This allows aggregation of the coloring agent to be prevented and inhibition of the polymerization reaction to be prevented, and therefore, excellent chromaticity and a sufficient degree of cure can be achieved.

Resin composition, adhesive tape, and method for producing adhesive tape

An anisotropic conductive film, containing a resin film; and conductive particles aligned into a monolayer within the resin film adjacent to or on one plane of the resin film with respect to a thickness direction of the resin film, wherein a distance between the one plane of the resin film and a center of the conductive particle is 9 &#x3bc;m or less based on 10-point average.

Method for producing an anisotropic conductive film

A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct. After the slurry was cooled, the polyfunctional isocyanate compound is added thereto to crosslink the ethyl cellulose film.

Latent curing agent for epoxy resin and method for manufacturing the same

An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be relatively easily controlled, is also provided. The aluminum chelate-based latent curing agent is made latent by reacting a silsesquioxane-type oxetane derivative with an aluminum chelating agent in the presence of an alicyclic epoxy compound.

Latent curing agent

A latent epoxy resin curing agent is provided which exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, adduct particles formed through adduct reaction of an epoxy-based compound with the particulate imidazole-based compound are coated with an ethyl cellulose film. Furthermore, the surfaces of the adduct particles may be crosslinked with a polyfunctional isocyanate compound. A mixture of the epoxy-based compound, the particulate imidazole-based compound, and ethyl cellulose in a predetermined saturated hydrocarbon-based solvent is heated under stirring. Then, the epoxy-based compound and the particulate imidazole-based compound are subjected to adduct reaction to give a slurry of the adduct. After the slurry is cooled, the latent epoxy resin curing agent is filtrated.

An aluminum chelate-based latent curing agent capable of curing a thermosetting epoxy resin under the condition of relatively low temperature in a short period of time is provided. Furthermore, a method for manufacturing the latent curing agent is provided, in which the curing conditions of the aluminum chelate-based latent curing agent can be controlled relatively easily. The aluminum chelate-based latent curing agent is prepared by reacting an aluminum chelate agent with a silsesquioxane type oxetane derivative in the presence of a water insoluble or poorly water-soluble cellulose ether, whereby latency properties are imparted thereto. This latent curing agent contains a coating layer composed of the water insoluble or poorly water-soluble cellulose ether. Preferably, the surface is treated with an isocyanate compound.

Growing community of inventors

Tochigi, Japan

Daisuke Masuko