Teikoku Tsushin Kogyo Co., Ltd.

Daisuke Makino

Shinji Mizuno

Takashi Yamada

Naoki Fukuda

Shinichi Suzuki

Kozo Morita

Takashi Shinoki

Masahiro Kitahara

Koji Mitsui

Katsutoshi Yanoshita

Shigemasa Takahashi

Kazutaka Nakagome

An electronic component mounting structure includes a flexible circuit board having terminal connection patterns formed thereon and a light-emitting component provided with electrodes. The light-emitting component is placed on the flexible circuit board, and a synthetic resin casing is injection-molded to cover the light-emitting component and a portion of the flexible circuit board surrounding the light-emitting component placed thereon, whereby the electrodes of the light-emitting component and the terminal connection patterns of the flexible circuit board are connected in abutting contact with each other.

Mounting structure and method for mounting electronic component onto circuit board

An electronic component substrate (-) includes an insulating base () and a flexible circuit board () mounted on the insulating base (). The flexible circuit board () is a synthetic resin film provided thereon with terminal patterns () and a conductor pattern () whose surface is slidingly contacted with a slider. The insulating base () is a synthetic resin molded piece. The flexible circuit board () is insert-molded to the insulating base (). The electronic component substrate (-) is produced by preparing the flexible circuit board () and first and second mold members () having a cavity (C) with a shape that corresponds to the external shape of the electronic component substrate (-). Then, the flexible circuit board () is accommodated in the cavity (C) between the first and second mold members (), and the cavity (C) is filled with a molten molding resin. After the molding resin has solidified, the first and second mold members () are removed.

Electronic parts board and method of producing the same

Growing community of inventors

Kanagawa, Japan

Daisuke Makino