Fujitsu Corporation

Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Daisuke Koizumi

Shigeyuki Maruyama

Kazuhiro Tashiro

Naoyuki Watanabe

Takafumi Hashitani

Takumi Kumatabara

Ei Yano

Eiji Yoshida

Toshimi Kawahara

Toshiyuki Honda

Kenichi Nagashige

Naohito Kohashi

Yoshito Konno

Keisuke Fukuda

Akira Sawamori

Yuji Akasaki

A tray is provided in combination with an electronic component attaching tool attached to the tray and includes an attachment depression part that includes an inner wall and to which an electronic component is attached, wherein forming of the inner wall of the attachment depression part does not substantially depend on an external shape of the electronic component, and a standard part formed in the inner wall of the attachment depression part and engaging with a first structure part of the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to a first position of the tray using the electronic component attaching tool, the standard part having a shape which does not substantially depend on the external shape of the electronic component.

Tray in combination with electronic component attaching tool attached to the tray

An IC socket in which an electronic component is attached to a predetermined position of the IC socket, the IC socket including a fixed part including a contact pin which is connected to a terminal of the electronic component when a position of the electronic component is aligned to the predetermined position of the IC socket using an electronic component attaching tool, the contact pin including a pair of end portions on an upper surface of the fixed part; a movable part that is movable to the fixed part when the movable part is pushed down to apply a force to the contact pin of the fixed part so as to separate the pair of end portions of the contact pin from each other; and a standard part that is formed on the movable part and engages with the electronic component attaching tool to align a position of the electronic component attaching tool to the standard part when a position of the electronic component is aligned to the predetermined position of the IC socket using the electronic attaching tool, the standard part having a shape which does not substantially depend on an external shape of the electronic component.

IC socket with attached electronic component

A component for a testing device for an electronic component includes a testing board; a projection electrode provided on a main surface of the testing board; a positioning part provided on the main surface of the testing board, the positioning part being configured to position the electronic component; and a pressing part configured to press the electronic component being positioned by the positioning part and make a lead part of the electronic component come in contact with the projection electrode so that the lead part is elastically deformed and made come in contact with the projection electrode.

Component for testing device for electronic component and testing method of the electronic component

A contact terminal formed of an electrically conductive material is arranged in each of a plurality of holed of a contactor substrate. An electrically conductive part is formed on an inner surface of each hole. The contact terminal has a first contact part that contacts a terminal of an electronic part and a second contact part that contacts the electrically conductive part in a middle portion. When the contact terminal bends by the first contact part being pressed, the second contact part contacts the electrically conductive part of the contactor substrate and an appropriate degree of contact pressure is obtained.

Contactor and test method using contactor

A contactor configured to be electrically connected to the terminals of an electronic component is disclosed. The connector includes multiple contact electrodes contacting the terminals of the electronic component and multiple elastic electrodes each composed of an electrically conductive elastic body. The elastic electrodes generate a pressing force for pressing the contact electrodes against the terminals of the electronic component. The contact electrodes are separable from the elastic electrodes.

Contactor for electronic components and test method using the same

An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.

Electronic component attaching tool

A contactor has contact electrodes elastically deformable in a direction of thickness of the contactor so that the contactor can make a contact with a semiconductor device with an appropriate contact pressure. The contactor is positioned between the semiconductor device and a test board so as to electrically connect the semiconductor device to the test board. Each of a plurality of contact electrodes has a first contact electrode part, a second contact electrode part and a connecting part electrically connecting the first contact electrode part to the second contact electrode part. The first contact electrode part contacts an electrode of the semiconductor device. The second contact electrode part contacts a terminal of the test board. A combining member has an insulating characteristic and holds the connecting part of each of the contact electrodes in a predetermined arrangement.

Contactor having contact electrodes of metal springs embedded in a plate-like structure

A contactor has a film substrate of an insulating material and plural wiring patterns on the substrate. A first end of each wiring pattern extends out from a first edge of the substrate as a first contact terminal and a second end of each wiring pattern extends out from a second edge of the substrate as a second contact terminal, and a part of the contactor located between the first end and second end can be deformed resiliently.

Contactor for testing miniaturized devices and components

Method of attaching electronic component and electronic component attaching tool

Contactor for testing semiconductor device and manufacturing method thereof

A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board. Displacements of the internal terminal resulting from the temperature load applied during testing of the wafer are compensated by the level transitioning portion of the first wiring. Unevenness involved with the contact between the contact electrodes on the probe card and the electrodes on the chips are compensated by the contact electrodes and/or elastic material. An electrode pitch of the contact electrodes is expanded by the first wiring.

Probe card and method of testing wafer having a plurality of semiconductor devices

A probe card for testing a wafer having formed a plurality of semiconductor chips, the probe card including a board and a multi-layer substrate. The probe card may also include a flexible substrate. A contact electrode, located opposite from an electrode on one of the chips, is disposed above or below the flexible substrate, or may be provided on an elastic material on the multi-layered substrate. A first wiring has a first portion connected to the contact electrode, a level transitioning portion extending from a level of the first portion to the multi-layer substrate at a lower level, and a connecting terminal at an end of the level transitioning portion connected to an internal terminal on the multi-layered substrate. A second wiring in the multi-layered substrate connects the internal terminal to an external terminal at a periphery of the multi-layer substrate. A third wiring on the board connects the external terminal on the multi-layer substrate to an external connecting terminal on the board. Displacements of the internal terminal resulting from the temperature load applied during testing of the wafer are compensated by the level transitioning portion of the first wiring. Unevenness involved with the contact between the contact electrodes on the probe card and the electrodes on the chips are compensated by the contact electrodes and/or elastic material according to the present invention. An electrode pitch of the contact electrodes is expanded by the first wiring.

A semiconductor substrate test device includes a contactor having contact electrodes to be connected with terminals formed on a semiconductor substrate, and a drag supply part supplying a drag to prevent a deformation of the contactor caused by a contact force resulting from contacts of the contact electrodes with the terminals.

Semiconductor substrate test device and method

An attachment structure between a semiconductor device socket and a test circuit substrate is provided. The semiconductor device socket includes a socket body and a contact film disposed therein. Extension conductive wires extended from a contact portion to be connected to a semiconductor device are formed on the contact film. The contact film is also provided with socket connectors connected to the extension conductive wires. The test circuit substrate is provided with circuit substrate connectors corresponding to the socket connectors. The socket connectors and the circuit substrate connectors are in a male-female connector relationship.

Growing community of inventors

Kawasaki, Japan

Daisuke Koizumi