Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Socionext Inc.

Daisuke Kimura

Naoki Kimura

Masato Sugita

Takashi Miyazaki

Shunsuke Hirano

Kenta Aruga

Shunichiro Masaki

Yasuhiro Majima

According to an embodiment, a semiconductor device includes a substrate, a connector, a volatile semiconductor memory element, multiple nonvolatile semiconductor memory elements, and a controller. A wiring pattern includes a signal line that is formed between the connector and the controller and that connects the connector to the controller. On the opposite side of the controller to the signal line, the multiple nonvolatile semiconductor memory elements are aligned along the longitudinal direction of the substrate.

Semiconductor device

A processing circuit includes: a clock generating circuit configured to generate, based on a reference clock signal and a frequency division ratio, a first clock signal; a frequency dividing and delay circuit configured to generate a second clock signal to have a first phase difference with the reference clock signal by dividing the frequency of the first clock signal and delaying the first clock signal based on a phase shift set signal and the frequency division ratio; an analog-to-digital converter circuit configured to convert an analog signal into a digital signal based on the first clock signal and a conversion trigger signal indicating a sampling period and a conversion period; and a control circuit configured to generate the conversion trigger signal to have the same cycle as the second clock signal based on the frequency division ratio and the first clock signal.

Processing circuit, radio communication circuit, and semiconductor integrated circuit

A semiconductor device includes a substrate, a semiconductor chip, and a sealing member. The semiconductor chip is disposed on the substrate. The semiconductor chip includes a first principal surface on a side of the substrate and a second principal surface on a side opposite to the first principal surface. The sealing member seals the semiconductor chip. The sealing member includes a first sealing member and a second sealing member. The second sealing member faces at least a part of the second principal surface. A permittivity of the second sealing member is lower than a permittivity of the first sealing member.

A semiconductor device includes a mounting substrate including an interface, which is connectable with a host, a surface-mounted component mounted on the mounting substrate and having first and second electrode groups, a first solder portion that is positioned between a first electrode in the first electrode group and the mounting substrate to electrically connect the first electrode and the mounting substrate, and a second solder portion that is positioned between a second electrode in the second electrode group and the mounting substrate to electrically connect the second electrode and the mounting substrate. The second solder portion has a larger contact area with the mounting substrate than the first solder portion. The second solder portion is positioned between at least one additional second electrode in the second electrode group to electrically connect the at least one additional second electrode and the mounting substrate.

Growing community of inventors

Kanagawa, Japan

Daisuke Kimura