Panasonic Corporation

Daisuke Katayama

Kou Komori

Subaru Matsumoto

Katsumi Otani

A heat generating component () is mounted on one surface of a circuit board (). A heat release member () is disposed between the one surface and an opposite wall () of a housing (). The heat release member () has a plate () that extends in a specified direction and is in contact with the heat generating component (), and fins () that project from the plate () toward the opposite wall (). In a region of the opposite wall () of the housing overlapping with the heat release member (), an air inlet () is provided so as to extend in the specified direction. The heat release member () is, at both end portions thereof in the specified direction, in contact with the opposite wall () via heat-conductive spacers (), and a gap () is formed between the fins () and the opposite wall ().

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Kyoto, Japan

Daisuke Katayama